No. 11, 2013
Power electronics
- Development Perspectives of Power Electronic Devices on Gallium Nitride pp. 5-12
- Power Transistors in AlN Metal/Ceramic Packages pp. 13-16
- New Clamping Si Diode Technology Integrated on a Heatsink pp. 19-21
Microwave electronic devices and technology
- Relevant Characteristics of Epitaxial Growth Technology of Microwave and RF PIN-Diodes at JSC «Optron» and its Perspectives pp. 22-29
- Industrial Process Design of Microwave Transistors on Heteroepitaxial Gallium Nitride Structures at State Plant Pulsar pp. 30-36
- Innovative Technologies in Production of Microwave Solid State Electronic Components pp. 37-44
- Importance of Layer-to-Layer Deprocessing of Chips for the Failure Analysis of State-of-Art Integrated Circuits pp. 45-49
- The Effects of Exposure to Fast Electron Radiation on High-Frequency Si PIN diodes and Schottky Barrier Diodes pp. 51-56
- Application of Plasma-Chemical Etching for pin Diode Technology pp. 57-60
- Guidelines of Information Technologies Development in the Comprehensive Automation at Research and Manufacturing Association «Pulsae pp. 61-70
Optoelectronics
- Semiconductor LED Electronics at Multisystem Cluster "Pulsar" JSC "Ruselectronics" pp. 71-78
- Semiconductor Light pp. 79-83
- Investigation of Cubic Boron Nitride Using the Colour Cathodoluminescence (CCL) and High Resolution Spectral Analysis in a Scanning Electron Microscope pp. 84-88
- Perspective Application of Cubic Boron Nitride for Electronic Devices Fabrication pp. 89-92
- Analysis of the Effect of Neutron Irradiation on the Size and Parameters of Optical Active Region and Current-Lumen-Voltage Characteristics of Quaternary AlGaInP and AlGaInN Heterostructures pp. 94-103
