Journals
Books
Articles by keyword многослойная печатная плата
LC-Filters Using Film Components Built-in Multilayer Printed-Circuit Boards
I.A. Korsh, K.V. Nikolaenko, I.A. Tikhonov, M.A. Evdokimov
Integrated filters of HF and VHF ranges realization issues with up-to-date materials
T.S. Khrolenko - Design Engineer, JSC «Omsk research institute of instrument engineering». E-mail: info@oniip.ru
A.I. Tyumentsev - Head Sector, JSC «Omsk research institute of instrument engineering». E-mail: info@oniip.ru
Reliability testing method interlayer compounds in multilayer PCBS mechanical effects
Z.H.M. Al-Araji - graduate student of the department of design and manufacture of radio, Voronezh State Technical University. E-mail: alaraje@bk.ru
A.V. Turetsky - Ph.Dr. (Eng.), associate professor designing and manufacture radio equipment chairs of the Voronezh State Technical University. E-mail: tav7@mail.ru
S.J. Beleckaja - Dr.Sci. (Eng.), professor of Systems of the Automated Design and Information Systems, Voronezh State Technical University
Printed circuit board interlayer connection reliability
A.V. Turetsky - Ph.D. (Eng.)., associate professor, designing and manufacture radio equipment chairs of the Voronezh State Technical University. E-mail: tav7@mail.ru
Principles of creating a phased active antenna array for mobile satellite terminals based on a multilayer printed circuit board

V.V. Denisenko1, V.N. Kozlov2, R.A. Kolesnikov3, Yu.B. Korchemkin4, Yu.V. Krivosheev5, B.A. Levitan6, A.M. Shitikov7, A.V. Shislov8,  Z.A. Janukian9, M.S. Uhm10, S.H. Yun11

1−9 PSC «Radiofizika» (Moscow, Russia)

2,6,9 Moscow Aviation Institute (National Research University) (Moscow, Russia)

4−8 Moscow Institute of Physics and Technology (National Research University) (Dolgoprudny, Russia)

10,11 ETRI (Gwangju, Republic of Korea)

Vibration analysis of multi-layer printed boards by means of CAE analysis

Z.Kh.M. Al-Aradzhi – Undergraduate, Department of Radio Equipment Engineering and Manufacturing,  Voronezh State Technical University

E-mail: alaraje@bk.ru

A.V. Muratov – Dr.Sc.(Eng.), Professor, Department of Radio Equipment Engineering and Manufacturing,  Voronezh State Technical University

E-mail: kipr@vorstu.ru

P.V. Ievlev – Post-graduate Student, Department of Radio Equipment Engineering and Manufacturing,  Voronezh State Technical University

E-mail: ievlev92@mail.ru

T.L. Turaeva – Ph.D.(Phys.-Math.), Head of Department of Physics, Voronezh State Technical University E-mail: tlturaeva@mail.ru

A.V. Turetsky – Ph.D.(Eng.), Associate Professor, Department of Radio Equipment Engineering and Manufacturing, Voronezh State Technical University

E-mail: tav7@mail.ru

Mathematical models of mechanical characteristics of multilayered PCB

Al-Araji Zainab Hussam Mosa – Undergraduate, 

Department Radio Equipment Engineering and Manufacturing, Voronezh State Technical University E-mail: alaraje@bk.ru

Methodology for choosing the optimal layout of multilayer printed circuit boards taking into account external mechanical influences

Z.H.M. Al-Araji Post-graduate Student 

Voronezh State Technical University (Voronezh, Russia)

E-mail: zainab.alaraje@mail.ru

O.Y. Makarov − Dr.Sc. (Eng.), Professor, 

Voronezh State Technical University (Voronezh, Russia)

E-mail: moy230@yandex.ru

A.V. Muratov Dr.Sc. (Eng.), Professor,

Voronezh State Technical University (Voronezh, Russia)

E-mail: kipr@vorstu.ru

A.V. Turetsky – Ph.D. (Eng.), Associate Professor

Voronezh State Technical University (Voronezh, Russia)

E-mail: tav7@mail.ru

Y.V. Khudyakov – Ph.D. (Phys.-Math.), Associate Professor

Voronezh State Technical University (Voronezh, Russia) E-mail: reus@vorstu.ru

Application of additive printer technology for the manufacture of multilayer printed boards

N.S. Trufanova1, E.R. Ragimov2, S.A. Artishchev3, A.G. Loschilov4

1–3 Tomsk State University of Control Systems and Radioelectronics (Tomsk, Russia)

4 Design & Engineering Bureau “Smena”, Tomsk State University of Control Systems and Radioelectronics (Tomsk, Russia)

Methodology for choosing the optimal layout of multilayer printed circuit boards taking into account external mechanical influences

Al-Araji Zainab Hussam Mosa1, I.S. Bobylkin2, A.V. Turetsky3, Yu.A. Pirogova4, R.N. Khoroshailov5

1 University of Baghdad (Baghdad, Republic of Iraq)

2-5 FSBEI of HE “Voronezh State Technical University” (Voronezh, Russia)