350 rub
Journal Radioengineering №10 for 2021 г.
Article in number:
Principles of creating a phased active antenna array for mobile satellite terminals based on a multilayer printed circuit board
Type of article: scientific article
DOI: https://doi.org/10.18127/j00338486-202110-05
UDC: 621.396.67
Authors:

V.V. Denisenko1, V.N. Kozlov2, R.A. Kolesnikov3, Yu.B. Korchemkin4, Yu.V. Krivosheev5, B.A. Levitan6, A.M. Shitikov7, A.V. Shislov8,  Z.A. Janukian9, M.S. Uhm10, S.H. Yun11

1−9 PSC «Radiofizika» (Moscow, Russia)

2,6,9 Moscow Aviation Institute (National Research University) (Moscow, Russia)

4−8 Moscow Institute of Physics and Technology (National Research University) (Dolgoprudny, Russia)

10,11 ETRI (Gwangju, Republic of Korea)

Abstract:

The paper describes concept of the phased array antenna made on a multilayered printed circuit board for the subscriber terminal of a modern Ka-band mobile communication system. Two options of the array are considered: Rx- and Tx- arrays. The architecture of the PAA is described, and main problems arising when creating such antennas are discussed. The ways of their solution are offered. The multilayer printed radiator is described in details. The proposed concept will be useful for design of the phased array antenna experimental model.

Pages: 42-52
For citation

Денисенко В.В., Козлов В.Н., Колесников Р.А., Корчемкин Ю.Б., Кривошеев Ю.В., Левитан Б.А., Шитиков А.М., Шишлов А.В., Янукьян З.А., Uhm M.S., Yun S.H. Принципы создания фазированной активной антенной решетки для терминалов спутниковой связи на основе многослойной печатной платы // Радиотехника. 2021. Т. 85. № 10. С. 42−52. DOI: https://doi.org/10.18127/j00338486-202110-05

References
  1. Anpilogov V., Shishlov A., Jejdus A. Mnogoluchevye antennye sistemy HTS. Tehnologii i sredstva svjazi. 2013. №. 6-2. S. 54−67 (In Russian).
  2. Anpilogov V., Shishlov A., Jejdus A. Analiz sistem LEO-HTS i realizuemosti fazirovannyh antennyh reshetok dlja abonentskih terminalov. Tehnologii i sredstva svjazi. 2015. №. 6-2. S. 14−26 (In Russian).
  3. Anpilogov V. i dr. Problemy sozdanija antenn s jelektricheskim skanirovaniem lucha dlja abonentskih terminalov sputnikovyh sistem svjazi v Ku-i Ka-diapazonah. Pervaja milja. 2019. №. 3. S. 16−27 (In Russian).
  4. Federal Communication Comission. FCC Selected Application. Report WR07.  File number: FCC  SES-LIC-20170223-00195.
  5. Mayo R., Harmer S. A Cost-Effective Modular Phased Array. IEEE International Symposium on Phased Array Systems and Technology. 2013. Р. 93−96
  6. Rebeiz Gabriel M. SiGe and CMOS for Advanced Phased-Array Communication and Radar Systems. Phased-Array Symposium Short Course. Boston. 2016. October 22.
  7. Krivosheev Yu.V., Shishlov A.V. Grating lobe suppression in phased arrays composed of identical or similar subarrays. Proc. Symposium on Phased Array Systems and Technology. Waltham-Boston. 2010. Р. 724−730.
  8. Steven Gao, Qi Luo, and Fuguo Zhu. Circularly Polarized Antennas. John Wiley & Sons, Ltd. 2014.
  9. Raney G., Unruh B., Lovestead R., and Winther B. 64-Element 28 Gigahertz Phased Array 5G Prototyping Platform. 11th Global Symposium on Millimeter Waves (GSMM). 2018
  10. Sandhu A.I., Arnieri E., Amendola G., Boccia L., Meniconi E., and Ziegler V. Radiating Elements for Shared Aperture Tx/Rx Phased Arrays at K/Ka Band. IEEE Trans. Antennas Propag. Apr. 2016. V. 64. № 6. Р. 2270−2282. 
  11. Su P., Sun D., and Zhang Z. A low-profile dual-polarized ka-band antenna for wide angle scanning phased arrays. Sixth Asia-Pacific Conference on Antennas and Propagation (APCAP). Xi'an. 2017. Р. 1−3.
  12. Chaloun T., Ziegler V., Menzel W. Design of a Dual-Polarized Stacked Patch Antenna for Wide Angle Scanning Reflectarrays. IEEE Trans. Antennas Propag. Month. 2016. V. XX. № X.
  13. Kolesnikov R.A., Korchemkin Y.B., Uhm M.S., Yun S.H. Circularly Polarized Multilayer Printed Radiator for Wide-Angle Scanning Ka-band Phased Array. International Conference on Engineering and Telecommunication (EnT-2020). 2020.
  14. Demystifying Vias in High Speed PCB Design. Keysight HSD Seminar.
  15. Andrea Bentini, Giovanni De Santis, Marco Bartocci. RF Solderless Vertical Interconnection for 3D Module Integration. Proceedings of the 46th European Microwave Conference.
  16. Ju-Joung Moon, Sang-Won Yun, Chang-Soo Ahn, Seon-Joo Kim. New Tile Structure for Microwave Modules Using Solderless Vertical Interconnections.
  17. Zhong-Jun Yu, Zheng Xu, Yun-Kai Deng, Zhi-Guang Zhang. An Overall LTCC Package Solution for X-Band Tile T/R Module. Progress in Electromagnetics Research Letters. 2013. V. 38. Р. 181−192.
  18. AN1902. Assembly guidelines for QFN (quad flat no-lead) and SON (small outline no-lead) packages. Rev.8.0. 6 February 2018. 51 p.
  19. QFN Package Mounting Guide. Rev. 0.1. 2016. Toshiba Corporation.
  20. John Priday. Thermal Management in high performance RF and microwave PCBs. Milsat Magazine. February 2019.
Date of receipt: 07.09.2021
Approved after review: 13.09.2021
Accepted for publication: 27.09.2021