Z.H.M. Al-Araji − Post-graduate Student
Voronezh State Technical University (Voronezh, Russia)
E-mail: zainab.alaraje@mail.ru
O.Y. Makarov − Dr.Sc. (Eng.), Professor,
Voronezh State Technical University (Voronezh, Russia)
E-mail: moy230@yandex.ru
A.V. Muratov − Dr.Sc. (Eng.), Professor,
Voronezh State Technical University (Voronezh, Russia)
E-mail: kipr@vorstu.ru
A.V. Turetsky – Ph.D. (Eng.), Associate Professor
Voronezh State Technical University (Voronezh, Russia)
E-mail: tav7@mail.ru
Y.V. Khudyakov – Ph.D. (Phys.-Math.), Associate Professor
Voronezh State Technical University (Voronezh, Russia) E-mail: reus@vorstu.ru
Formulation of the problem. A multilayer printed circuit board (multilayer PCB) is a rather complex design, as it consists of fiberglass composites and a large number of conductive layers. The board provides both electrical connection of electronic components and their mechanical fastening. When using boards in structures subjected to mechanical loads, the reliability of the multilayer PCB determines the reliability of the entire structure as a whole. Therefore, the design of multilayer PCB subjected to mechanical stress is a complex task. To increase the efficiency of the design process, it is necessary to reduce time and material costs by applying the modeling process and engineering analysis at the initial stages of the design of the multilayer PCB.
Purpose. Investigate the accuracy of modeling the mechanical characteristics of multilayer PCB in a Creo environment. Determine the best way to secure the multilayer PCB and identify the effect of a concentrated mass located in different places on the board on resistance to mechanical stress.
Results. A method for designing printed circuit boards is proposed, which includes two stages. First, the PCB vibration analysis is performed using the FEM method using the “concentrated weight” element, which replaces the actual geometry of the component. The second step is to choose the optimal type of fixation for the printed circuit board, which provides a minimal effect of vibration. We investigated four types of fixing the sides of the board. At the same time, an analytical calculation of the behavior of the boards and modeling using the finite element method (FEM) and engineering analysis using Cero Elements / Pro 5.0 was carried out. The results of modeling comparison and analytical calculation showed good agreement, the difference does not exceed 12%.
The boundary conditions of the circuit board have a significant effect on the vibrational characteristics of the circuit board. The highest natural frequency was obtained by fixing the four sides of the board, when the maximum rigidity of the structure is provided. This is the best way to fix, but it can not always be used, therefore, other methods of fixing are investigated. The classification process of fixing methods was carried out depending on the results of determining the natural frequency, from the best to the least best. Practical significance. A methodology for designing the multilayer PCB is proposed, which differs from the traditional ones in a shorter time for finalizing the design by applying modeling.
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