350 rub
Journal Radioengineering №7 for 2018 г.
Article in number:
Vibration analysis of multi-layer printed boards by means of CAE analysis
Type of article: scientific article
DOI: 10.18127/j00338486-201807-08
UDC: 621.396.96
Authors:

Z.Kh.M. Al-Aradzhi – Undergraduate, Department of Radio Equipment Engineering and Manufacturing,  Voronezh State Technical University

E-mail: alaraje@bk.ru

A.V. Muratov – Dr.Sc.(Eng.), Professor, Department of Radio Equipment Engineering and Manufacturing,  Voronezh State Technical University

E-mail: kipr@vorstu.ru

P.V. Ievlev – Post-graduate Student, Department of Radio Equipment Engineering and Manufacturing,  Voronezh State Technical University

E-mail: ievlev92@mail.ru

T.L. Turaeva – Ph.D.(Phys.-Math.), Head of Department of Physics, Voronezh State Technical University E-mail: tlturaeva@mail.ru

A.V. Turetsky – Ph.D.(Eng.), Associate Professor, Department of Radio Equipment Engineering and Manufacturing, Voronezh State Technical University

E-mail: tav7@mail.ru

Abstract:

The mechanical characteristics of multi-layer printed circuit boards (MPCB) determine, basically, the reliability of the entire device as a whole. The article is devoted to the issues of identifying the possibilities of modeling the mechanical characteristics of multi-layer printed circuit boards using the means of engineering analysis (CREO), since the results of modeling influence the amount of changes introduced to the design of the product during its finalization. Of great importance is the accuracy of modeling, which in turn depends on the given boundary conditions. The influence of boundary conditions and concentrated mass on the vibrational characteristics of a printed circuit board is analyzed. A comparative modal analysis of MPCB with various points of fixation and distribution of the mass of the installed components was carried out.

Pages: 40-45
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Date of receipt: 11 мая 2018 г.