N.S. Trufanova1, E.R. Ragimov2, S.A. Artishchev3, A.G. Loschilov4

1–3 Tomsk State University of Control Systems and Radioelectronics (Tomsk, Russia)

4 Design & Engineering Bureau “Smena”, Tomsk State University of Control Systems and Radioelectronics (Tomsk, Russia)

The article considers the manufacture of a multilayer printed circuit board using additive printing technology. The production of thick-film printed circuit boards is carried out by screen printing. However, screen printing has a number of disadvantages: the high cost of manufacturing stencils and their combination, the high complexity of operations, excessive consumption of materials, the impossibility of simultaneous application of different materials. Eliminating these shortcomings is possible with the help of printer technology. Printer technology consists in applying pastes to the substrate using specialized devices (printers) directly according to a digital model using a piston or screw dispenser.

Analysis of literary sources showed that research in the field of printed electronics is aimed at the manufacture of single-layer printed circuit boards. The purpose of this work is to conduct experimental studies of methods for dispensing pastes and the possibility of manufacturing a multilayer printed circuit board using additive printer technology.

The study of the printer technology for the manufacture of single-layer elements was carried out on a piston and screw dispenser. The paper shows the possibility of manufacturing printed elements with a width of 150 microns and a thickness of 20 microns. A comparison of the two dosing methods showed that screw dosing should be chosen when printing with high viscosity pastes.

The printing of a multilayer printed circuit board was carried out on a printer according to the screw dosing principle. The conductors were printed with a width of 0.3 mm and a thickness of 20 µm. To isolate the conductors and prevent breakdown of the dielectric, the insulating layer was printed in two passes, which made it possible to increase the layer thickness to 35 μm. The printed circuit board uses one via, designed for interlayer connection of conductors and contact pads. As a result, a working model of a four-layer switching board with mounted LEDs was made.

Trufanova N.S., Ragimov E.R., Artishchev S.A., Loschilov A.G. Application of additive printer technology for the manufacture of multilayer printed boards. Nanotechnology: the development, application – XXI Century. 2022. V. 14. № 4. Р. 37-44. DOI: https://doi.org/10.18127/j22250980-202204-04 (In Russian).

1. Tan H.W., Choong Y.Y.C., Kuo C.N., Low H.Y., Chua C.K. 3D printed electronics: Processes, materials and future trends. Progress in Materials Science. 2022. V. 127. P. 100945.
2. Tuyev V.I., Malyutin N.D., Loshchilov A.G., Artishchev S.A., Zdrok A.E., Allanurov A.M., Bombizov A.A., Karaulnykh S.P., Makarov I.M., Ubaychin A.V. Issledovaniye vozmozhnostey primeneniya additivnoy printernoy tekhnologii formirovaniya plenok organicheskikh i neorganicheskikh materialov elektroniki. Doklady Tomskogo gosudarstvennogo universiteta sistem upravleniya i radioelektroniki. 2015. № 4 (38). S. 194. (in Russian).
3. Wiklund J., Karakoç A., Palko T., Yiğitler H., Ruttik K., Jantti R., Paltakari J. A review on printed electronics: Fabrication methods, inks, substrates, applications and environmental impacts. Journal of Manufacturing and Materials Processing. 2021. V. 5. № 3. P. 89.
4. Azucena O., Kubby J., Scarbrough D., Goldsmith C. Inkjet Printing of Passive Microwave Circuitry// IEEE MTT-S International Microwave Symposium Digest. 2008. P. 1328.
5. Merilampi S.L., Bjorninen T., Vuorimaki A., Ukkonen L., Ruuskanen P., Sydanheimo L. The Effect of Conductive Ink Layer Thickness on the Functioning of Printed UHF RFID Antennas. Proceedings of the IEEE. 2010. V. 98. № 9. P. 1610–1619.
6. Kim S., Cook B., Le T., Cooper J., Lee H. Inkjet-printed antennas, sensors and circuits on paper substrate// IET Microwaves, Antennas and Propagation. 2013. V. 7. № 10. P. 858–868.
7. Pongpaibool P, Wallada W, Siwamogsatham S. A Study of Multi-Conductivity Dipole Antenna for Printed UHF RFID. Third International Conference on Consumer Electronics: National Electronics and Computer Technology Center. 2013. P. 93–97.
8. Pongpaibool P., Wallada W., Siwamogsatham S. A Thickened-and-Widened Feed Dipole Antenna with an Inductive Matching Loop for a Printed UHF RFID Tag. National Electronics and Computer Technology Center. 2014. V. 3. P. 2092–2096.
9. Haerinia M., Noghanian S. Design of Hybrid Wireless Power Transfer and Dual Ultrahigh-Frequency Antenna System. 2019 URSI International Symposium on Electromagnetic Theory (EMTS). 2019. P. 4.
10. Haerinia M., Noghanian S. A Printed Wearable Dual-Band Antenna for Wireless Power Transfer. Sensors. 2019. V. 19. № 7. P. 1732.
11. Shadid R., Haerinia M., Noghanian S. Study of Rotation and Bending Effects on a Flexible Hybrid Implanted Power Transfer and Wireless Antenna System. Sensors. 2020. V. 20. № 5. P. 1368.
12. Trufanova N.S., Artishchev S.A., Ragimov E.R., Loschilov A.G., Malyshenko A.M. Technique for extraction of electric frequency parameters of conductive ink. Journal of Physics: Conference Series. IOP Publishing. 2022. V. 2291. № 1. P. 7.
13. Kreit E., Steffen T., Aga R., Bartsch C., Wu B. I., Heckman E. Printed multilayer conformal x-band antenna array. Flexible and Printed Electronics. 2017. V. 2. № 4. P. 045009.
14. Correia V., Mitra K.Y., Castro H., Rocha J.G., Sowade E., Baumann R.R., Lanceros-Méndez S. Design and fabrication of multilayer inkjet-printed passive components for printed electronics circuit development. Journal of Manufacturing Processes. 2018. V. 31. P. 364–371.
15. Hardin J.O., Grabowski C.A., Lucas M., Durstock M.F., Berrigan J.D. All-printed multilayer high voltage capacitors with integrated processing feedback. Additive Manufacturing. 2019. V. 27. P. 327–333.
16. Trufanova A.S., Trufanova N.S. Opredeleniye propusknoy sposobnosti porshnevogo dozatora provodyashchikh past. Sbornik izbrannykh statey po materialam Mezhdunarodnoy nauchno-tekhnicheskoy konferentsii studentov. aspirantov i molodykh uchenykh «Nauchnaya sessiya TUSUR-2020». Tomsk: Izd-vo "V-Spektr". 2020. Ch. 1. S. 157. (in Russian).
17. Korzh I.A., Tanskaya T.N. Pretsizionnyye tonkoplenochnyye mnogosloynyye kommutatsionnyye platy so vstroyennymi nagrevatelyami i rezistorami. Tekhnika radiosvyazi. 2014. №. 1. S. 85–94. (in Russian).