Journals
Books
Articles by keyword solder
Design-technological analysis of solderless press-fit connections
F. G. Plotnikov, A. P. Chuyev
Test methods connections solder of surface mounted device on mechanical influences
I.A. Lozovoy, A.V. Turetsky, V.A. Shuvaev
Test subsystem solder of electronic components connections on mechanical influences
I.A. Lozovoy, A.V. Turetsky
Test methods connections solder of components mounted in hole on mechanical influences
I.A. Lozovoy, A.V. Turetsky
The automated system of test components connections solder of radio-electronic modules on mechanical influences
I.A. Lozovoy, A.V. Turetsky
Statistical processing connections tests solder results of components of radio-electronic modules
I.A. Lozovoy, A.V. Turetsky
Technique of the analysis of radio-electronic modules on mechanical durability
I.A. Lozovoy, A.V.Turetsky
Manufacturing technology of sealed off high-pressure spark gap-sharpeners with voltages up to 500 kilovolts

D.S. Makhanko

JSC Research Institute of Gas-Discharge Devices (Ryazan, Russia)

Crystal on the base of the case with improved characteristics

A.R. Shakhmayeva1, E. Kazalieva2

1,2 Dagestan State Technical University (DSTU) (Makhachkala, Russia)
1 fpk12@mail.ru, 2 kazanova.em@mail.ru

A method for minimizing voids in solder joints on a printed circuit board

S.A. Protsenko1, A.V. Turetsky2, Yu.A. Pirogova3, I.V. Goncharenko4

1-4 FSBEI of HE “Voronezh State Technical University” (Voronezh, Russia)

1 sergo2023@bk.ru; 2 tav7@mail.ru; 3 pirogov.alx@gmail.com, 4clashofclans22885@gmail.com