Journals
Books
Articles by keyword печатные платы
Preparation of inside layers of printed circuit boards for surface mount technology
М.S. Moskovskih - JSC «Academican M.F. Reshetnev «Information Satellite Systems», Zheleznogorsk. E-mail: Iss031@mail.ru L.V. Ipat-eva - JSC «Academican M.F. Reshetnev «Information Satellite Systems», Zheleznogorsk. E-mail: Iss031@mail.ru А.P. Lebedev - JSC «Academican M.F. Reshetnev «Information Satellite Systems», Zheleznogorsk. E-mail: Iss031@mail.ru А.А. Levitskiy - Siberian Federal University, Krasnoyarsk. E-mail: Iss031@mail.ru
Software-technical complex «Graphics – TR» as a universal tool for solving engineering problems in the modern world of design automation

S.V. Smirnov – Ph.D. (Eng.), Senior Research Scientist,

Institute of Management Problems V.A. Trapeznikov RAS

E–mail: sapr2006@bk.ru

L.N. Sizova – Leading Software Engineer,

Institute of Management Problems V.A. Trapeznikov RAS

E–mail: lusysz@ipu.ru

Embedded multilayer strip-line microwave filters

V.A. Maklashov – Deputy Director of Design Office in Radio Engineering Systems

JSC «SRI «Ekran» (Samara)

E-mail: mg37@rambler.ru

Application of neural networks in detecting PCB defects

A.I. Vlasov1, N.V. Zavyalov2, K.V. Selivanov3, I.I. Skalchenkov4

1–4 Bauman Moscow State Technical University (Moscow, Russia)

Application of EDA-system to search shortest way on electronic map of information system with geographical reference

S.V. Smirnov1, L.N. Sizova2

1−2 V.A. Trapeznikov Institute of Control Sciences of RAS (Moscow, Russian)

Methodology for improving the cooling efficiency of multi-layer printed circuit boards using an array of thermal vias

N.V. Tsipina1, N.E. Samoilenko2, D.R. Voronin3, K.D. Tsipina4

1-4 FSBEI of HE “Voronezh State Technical University” (Voronezh, Russia)

1 tcnv@mail.ru; 2 ju.i@mail.ru; 3 brk19frte6@gmail.com, 4 ksutsipina@mail.ru