М.S. Moskovskih - JSC «Academican M.F. Reshetnev «Information Satellite Systems», Zheleznogorsk. E-mail: Iss031@mail.ru L.V. Ipat-eva - JSC «Academican M.F. Reshetnev «Information Satellite Systems», Zheleznogorsk. E-mail: Iss031@mail.ru А.P. Lebedev - JSC «Academican M.F. Reshetnev «Information Satellite Systems», Zheleznogorsk. E-mail: Iss031@mail.ru А.А. Levitskiy - Siberian Federal University, Krasnoyarsk. E-mail: Iss031@mail.ru

The analysis of the tests results of adhesion strengthening process USAD-1100 in the production of multilayered printed-circuit boards is submitted. Printed-circuit boards were exposed to different types of tests for confirmation of their production quality and check in modes of installation and possibility of ready PCB repair. Tests were made with use of special processing equipment. Control was exercised by means of the equipment of the optical control, the automated tester, by research metallo-graphic thin sections. The analysis of the results shows that multilayered printed-circuit boards, made with use of process of USAD-1100, meet requirements of standard technical documentation.

 

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