Article or book title, author's surname, DOI

Aspects of processing development for MOCVD growth of InAlN/GaN heterostructures for microwave transistors with high output power density

V.А. Burobin1, N.I. Kargin2, А.М. Konovalov3, А.А. Makarov4, А.А. Shchuka5

research article Pages: 22-26

  1. 1 Ph.D. (Eng.), General Director, JSC «GZ Pulsar»
  2. 2 Dr.Sc. (Eng.), Professor, Vice Rector, National Research Nuclear University (NRNU MEPHI)
  3. 3 Head SKB SSP, JSC «GZ Pulsar»
  4. 4 Leading Expert, JSC «GZ Pulsar»
  5. 5 Dr.Sc. (Eng.), Professor, Moscow Institute of Physics and Technology

Abstract

A comparative analysis of substrate materials for heteroepitaxial growth of InAlN/GaN structures is made, processing issues of InAlN/GaN heteroepitaxial structures formation are presented, effects of processing technology parameters on composition and characteristics of epitaxially grown InxAl1-xN layers are modelled.

How to cite

Буробин В.А., Каргин Н.И., Коновалов А.М., Макаров А.А., Щука А.А. Особенности разработки процесса выращивания структур InAlN/GaN методом газофазной эпитаксии из металлорганических соединений, применяемых в СВЧ-транзисторах с высокой удельной выходной мощностью // Нанотехнологии: разработка, применение - XXI век. 2015. № 1. С. 22–26.

References

 

  1. Burobin V.A. Novoe pokolenie ehlektronnojj tekhniki: Perspektivy razvitija priborov silovojj ehlektroniki na osnove nitrida gallija // Tekhnopolis XXI. 2012. Sentjabr. S. 18-19.
  2. Burobin V.A. Razrabotka konstrukcii i promyshlennojj tekhnologii izgotovlenija moshhnogo SVCH tranzistora na baze geteroehpitaksialnojj struktury AlGaN/GaN // Oboronnyjj kompleks - nauchno-tekhnicheskomu progressu Rossii. 2012. № 4. S. 66-71.
  3. Lobanova A.V. et al. AlInN MOVPE: growth chemistry and analysis of trends // Journal of Crystal Growth. 2012. T. 352. № 1. S. 199-202.
  4. Medjdoub F. et al. Status of the emerging InAlN/GaN power HEMT technology // Open Electrical & Electronic Engineering Journal. 2008. T. 2. S. 1-7.
  5. Lee D.S. et al. InAlN/GaN HEMTs with AlGaN back barriers // Electron Device Letters, IEEE. 2011. T. 32. № 5. S. 617‑619.