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Articles by keyword multilayered printed-circuit boards
Preparation of inside layers of printed circuit boards for surface mount technology
М.S. Moskovskih - JSC «Academican M.F. Reshetnev «Information Satellite Systems», Zheleznogorsk. E-mail: Iss031@mail.ru L.V. Ipat-eva - JSC «Academican M.F. Reshetnev «Information Satellite Systems», Zheleznogorsk. E-mail: Iss031@mail.ru А.P. Lebedev - JSC «Academican M.F. Reshetnev «Information Satellite Systems», Zheleznogorsk. E-mail: Iss031@mail.ru А.А. Levitskiy - Siberian Federal University, Krasnoyarsk. E-mail: Iss031@mail.ru