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Articles by keyword multi-layer printed circuit board
Vibration analysis of multi-layer printed boards by means of CAE analysis

Z.Kh.M. Al-Aradzhi – Undergraduate, Department of Radio Equipment Engineering and Manufacturing,  Voronezh State Technical University

E-mail: alaraje@bk.ru

A.V. Muratov – Dr.Sc.(Eng.), Professor, Department of Radio Equipment Engineering and Manufacturing,  Voronezh State Technical University

E-mail: kipr@vorstu.ru

P.V. Ievlev – Post-graduate Student, Department of Radio Equipment Engineering and Manufacturing,  Voronezh State Technical University

E-mail: ievlev92@mail.ru

T.L. Turaeva – Ph.D.(Phys.-Math.), Head of Department of Physics, Voronezh State Technical University E-mail: tlturaeva@mail.ru

A.V. Turetsky – Ph.D.(Eng.), Associate Professor, Department of Radio Equipment Engineering and Manufacturing, Voronezh State Technical University

E-mail: tav7@mail.ru