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Articles by keyword полупроводниковый прибор
Shaping the mathematical models semiconductor instrument for analysis of robustness of the electronic schemes
A.V. Bondarev
Shaping the mathematical models semiconductor instrument for analysis of robustness of the electronic schemes
A.V. Bondarev - Ph.D. (Eng.), Head of the Department of Power Supply of the Industrial Enterprises, Kumertausky Branch of Orenburg State University
Parametres and technique of receiving of heat-absorbent materials for semiconductor device
M.V. Inyuhin - Engineer, «Ekolyum-Voshod». E-mail: sintel40@yandex.ru
A.P. Korzhavyi - Dr.Sc. (Eng), Professor, Bauman Moscow State Technical University, Kaluga Branch. E-mail: fn2kf@list.ru
G.V.Prasitsky - Student, Bauman Moscow State Technical University, Kaluga Branch. E-mail: fn2kf@list.ru
Application of tungsten-copper pseudoalloys for heat dissipation in the packaging of power semiconductor devices
M.V. Inyukhin - Process Engineer, LLC «Ecolum-Voskhod» (Kaluga) E-mail: michael1@kaluga.ru A.P. Korzhavyi - Honored Scientist of RF, Dr. Sc. (Eng.), Professor, Kaluga branch of the Bauman MSTU E-mail: fn2kf@list.ru
Probabilistic characteristics of levels of electromagnetic defeat of semiconductor devices and radioelectronic tools

А.А. Volkov – Ph.D. (Eng.), Lecturer, Military Educational-Research Centre of Air Force «Air Force Academy Named After Professor N.E. Zhukovsky and Y.A. Gagarin» (Voronezh) E-mail: volkov_aa@autorambler.ru