Journals
Books
Articles by keyword многослойные печатные платы
Preparation of inside layers of printed circuit boards for surface mount technology
М.S. Moskovskih - JSC «Academican M.F. Reshetnev «Information Satellite Systems», Zheleznogorsk. E-mail: Iss031@mail.ru L.V. Ipat-eva - JSC «Academican M.F. Reshetnev «Information Satellite Systems», Zheleznogorsk. E-mail: Iss031@mail.ru А.P. Lebedev - JSC «Academican M.F. Reshetnev «Information Satellite Systems», Zheleznogorsk. E-mail: Iss031@mail.ru А.А. Levitskiy - Siberian Federal University, Krasnoyarsk. E-mail: Iss031@mail.ru
Embedded multilayer strip-line microwave filters

V.A. Maklashov – Deputy Director of Design Office in Radio Engineering Systems

JSC «SRI «Ekran» (Samara)

E-mail: mg37@rambler.ru

Methodology for improving the cooling efficiency of multi-layer printed circuit boards using an array of thermal vias

N.V. Tsipina1, N.E. Samoilenko2, D.R. Voronin3, K.D. Tsipina4

1-4 FSBEI of HE “Voronezh State Technical University” (Voronezh, Russia)

1 tcnv@mail.ru; 2 ju.i@mail.ru; 3 brk19frte6@gmail.com, 4 ksutsipina@mail.ru