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Articles by keyword mathematical model of workload distribution in a group of wafers
Mathematical model of double-sided polishing of a group of simultaneously processed silicon wafers

I.I. Danilov1, N.G. Nazarov2, D.D. Dmitriev3, S.N. Sinavchian4, V.S. Sinavchian5

1–5 Bauman Moscow State Technical University (Moscow, Russia)