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Journal Nanotechnology : the development , application - XXI Century №3 for 2022 г.
Article in number:
Mathematical model of double-sided polishing of a group of simultaneously processed silicon wafers
Type of article: scientific article
DOI: https://doi.org/10.18127/j22250980-202203-03
UDC: 621.923
Authors:

I.I. Danilov1, N.G. Nazarov2, D.D. Dmitriev3, S.N. Sinavchian4, V.S. Sinavchian5

1–5 Bauman Moscow State Technical University (Moscow, Russia)

Abstract:

The production of modern solid-state integrated circuits uses silicon semiconductor wafers as a blank. The accuracy of the geometric shape of the plates required for this is ensured during finishing polishing operations. The most productive is the double–sided polishing of a group of work pieces on the machine. The calculation of the evolution of the geometric shape of the plate during such processing requires the development of a mathematical model of pressure distribution, which depends on the distribution of the workload between the work pieces of the same group during their joint processing on the machine.

Objective – to develop a mathematical model of double-sided polishing of a group of simultaneously processed silicon wafers. A mathematical model of double-side polishing of a group of simultaneously processed silicon wafers allowing to calculate the workload for each wafer has been developed.

Practical significance – the use of the research results allows us to develop a mathematical model of the process of double-sided polishing on a machine of a group of silicon wafers and calculate the optimal technological modes of this operation.

Pages: 22-30
For citation

Danilov I.I., Nazarov N.G., Dmitriev D.D., Sinavchian S.N., Sinavchian V.S. Mathematical model of double-sided polishing of a group of simultaneously processed silicon wafers. Nanotechnology: the development, application – XXI Century. 2022. V. 14. № 3.  Р. 22−30.

DOI: https://doi.org/10.18127/j22250980-202203-03 (In Russian)

References
  1. Danilov I.I., Nazarov N.G., Dmitriyev D.D., Sinavchian S.N., Sinavchian V.S. Matematicheskaya model raspredeleniya davleniya na kremniyevyye plastiny pri dvustoronnem polirovanii. Nanotekhnologii: razrabotka. primeneniye – XXI vek. 2021. T. 13. № 4. S. 60–67. (in Russian).
  2. Dyuzhikov V.I. Vybor optimalnykh usloviy polirovaniya ploskikh poverkhnostey kvartsevykh plastin. Elektronnaya tekhnika. Ser. 10. 1972. Vyp. 3. S. 100–107. (in Russian).
  3. Korn G., Korn T. Spravochnik po matematike dlya nauchnykh rabotnikov i inzhenerov. M.: Nauka. 1977. 832 s. (in Russian).
Date of receipt: 20.06.2022
Approved after review: 05.07.2022
Accepted for publication: 31.08.2022