Journals
Books
Articles by keyword тепловое моделирование
System-in-Package: Mounting Bare Chips as a Method for Increasing the Integration Level of Multifunctional Modules
Т. S. Dyachenko
Research of thermal and mechanical characteristics of the on-board device of the secondary power supply

I.A. Ivanov1, R.M. Uvaysov2

1, 2 MIREA – Russian Technological University (Moscow, Russia)

Modeling of thermal modes of the information conversion unit of a data reception, transmission and processing device in a radio correction line

V.V. Chernoverskaya1, S.U. Uvaysov2, D.E. Stepanova3, D.O. Boriskina4

1-4 MIREA – Russian Technological University (Moscow, Russia)

1 v_chernoverskaya@mail.ru; 2 uvajsov@mirea.ru; 3 magistracy_dasha@bk.ru

Modernization of the cooling system of the power supply cell of the simulation and filtering unit of a mobile radar

G.P. Raevskiy1, I.V. Chechel2, A.A. Zavolokin3

1–3 RTU MIREA (Moscow, Russia)

1 geraevskiy@yandex.ru, 2 chechel.i.v@mail.ru, 3 zavolokin_2011@mail.ru