Т. S. Dyachenko

A perspective direction for increasing functional capabilities with lowering power consumption and reduction of weight and size of the electronic equipment is the use of new design technologies «System-on-Chip» and «System-in-Package». The technology of the development of large-scale integrated electronic chips («System-on-Chip») assumes a possibility of implementation of complex systems on a single chip, but taking into account the necessity of engaging highly skilled developers, long development process and absence of the hi-tech enterprises for manufacturing these systems on the territory of Russia, is not the most effective decision. The technology of combing several super large-scale integrated circuit (SLSIC) in one case with passive components («system-in-package» or SIP) is a complex solution oriented to joint designing one or several SLSIC of SoC and their case, integrated with a platform of both digital and analog design of SLSIC and providing an open designing route, beginning with an input of the project, and finishing with an output of the necessary data for the manufacture. But with obtaining new functional capabilities new problems associated with the implementation of small-size structures appear: the problems of lowering the noise of high speed SLSIC, the reduction of thermal radiation, and the most complicated problem of electromagnetic compatibility of circuit components. The placement of bare chips on a board of SiP in many respects helps to solve incipient problems and lower the system cost considerably, as about 60 % of cost of a chip in the package are the costs of acquiring the case and mounting a crystal in it. Variants for the placement of microcircuit bare chips on the common bases-substrates are considered in the paper, their advantages and drawbacks are estimated. The Package-in-System technology-based original design for the superregenerative control receiver monocrystal module is offered. The calculation of the possibility of packaging the crystal and modeling thermal modes of the module have been performed, which resulted in the pre-production models of the superregenerative control receiver module. As a result of the work it is stated that the developed module of the control receiver of a class «system-in-package» can be used as a complete independent device or as a component of more complex system with the possibility of the placement on the printed circuit board. The use of the «System-on-Chip» and «System-in-Package» modern design technologies has allowed the development of the control system receiver multifunctional module of the high integration level with optimal electrical parameters, weight and size in the shortest time.