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Articles by keyword силовая электроника
Methodology for improving the cooling efficiency of multi-layer printed circuit boards using an array of thermal vias

N.V. Tsipina1, N.E. Samoilenko2, D.R. Voronin3, K.D. Tsipina4

1-4 FSBEI of HE “Voronezh State Technical University” (Voronezh, Russia)

1 tcnv@mail.ru; 2 ju.i@mail.ru; 3 brk19frte6@gmail.com, 4 ksutsipina@mail.ru