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A method for minimizing voids in solder joints on a printed circuit board

S.A. Protsenko1, A.V. Turetsky2, Yu.A. Pirogova3, I.V. Goncharenko4

1-4 FSBEI of HE “Voronezh State Technical University” (Voronezh, Russia)

1 sergo2023@bk.ru; 2 tav7@mail.ru; 3 pirogov.alx@gmail.com, 4clashofclans22885@gmail.com