Journals
Books
Articles by keyword тепловой анализ
Simulation of three-dimensional thermal fields in integrated circuits assembly
A.V. Achkasov - Ph.D. (Eng.), Research Institute of Electronic Engineering. E-mail: achkasov@list.ru
V.F. Barabanov - D.Sc. (Eng.), Professor, Voronezh State Technical University. E-mail: bvf@list.ru
M.N. Aralov - Research Institute of Electronic Engineering E-mail: aralow@mail.ru S.L. Podvalniy - Dr. Sc. (Eng.), Professor, Voronezh State Technical University. E-mail: spodvalny@yandex.ru
Design of the printing unit of the control device for the take-off process of the aircraft

S.U. Uvaisov1, V.V. Chernoverskaya2, Nguyen Viet Dang3, Nguyen Van Tuan4

1–4 MIREA – Russian Technological University (Moscow, Russia)