I.I. Danilov1, N.G. Nazarov2, D.D. Dmitriev3, S.N. Sinavchian4, V.S. Sinavchian5

1–5 Bauman Moscow State Technical University (Moscow, Russia)

The production of a modern solid-state integrated circuits uses silicon semiconductor wafers as a blank. The accuracy of the geometric shape of the plates required for this is ensured during finishing polishing operations. The most productive is double-sided polishing. The calculation of the evolution of the geometric shape of the plate during polishing requires the development of a mathematical model of the pressure distribution on silicon wafers, taking into account the main factors.

Objective – to develop a mathematical model of pressure distribution on silicon wafers during two-sided polishing.

A mathematical model of the elastic-deformed state of an axisymmetric geometric silicon wafer with two-sided polishing, allowing calculating pressure diagrams on the wafers, has been developed.

The use of the research results allows to develop the mathematical model of the polishing process of silicon wafers and to calculate the optimal technological modes of this operation.

Danilov I.I., Nazarov N.G., Dmitriev D.D., Sinavchian S.N., Sinavchian V.S. Mathematical model of the pressure distribution on silicon wafers during two-sided polishing. Nanotechnology: development and applications – XXI century. 2021 V. 13. № 4. P. 60–67. DOI: https://doi.org/10.18127/j22250980-202104-06 (in Russian)

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