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Journal Electromagnetic Waves and Electronic Systems №1 for 2019 г.
Article in number:
Implementation of the sensitive hall element structure
Type of article: scientific article
DOI: DOI: 10.18127/j15604128-201901-07
UDC: УДК 621.382
Authors:

V.I. Gusev – General Director of LLC «MAGNITEX SPB» (Saint–Petersburg)
E-mail: magnitex1@yandex.ru
Aung Kyaw Kyaw – Post-graduate Student, Kaluga branch of the Bauman MSTU
E-mail: akkyaw.bmstu.50@gmail.com
O.Yu. Egorova – Student, Kaluga branch of the Bauman MSTU
E-mail: oksana.egorova95@yandex.ru
V.S. Zaionchkovsky – Ph.D.(Phys.-Math.), Associate Professor, Kaluga branch of the Bauman MSTU E-mail: vz48@post.ru
V.V. Paramonov – Ph.D.(Chem.), Associate Professor, Kaluga branch of the Bauman MSTU E-mail: victorparamonov@yandex.ru

Abstract:

A technological process has been developed for producing Hall converter crystals based on InSb/GaAs epitaxial heterostructures. The parameters of the processes of forming the topology of crystals were optimized using the processes of vacuum sputtering and galvanic deposition of metals. The parameters of contact layers of copper that meet the requirements of instrument assembly operations have been achieved.
Measuring Hall sensors are widely used in instrument making and in the automotive industry, as having linearity in a wide range of magnetic field induction. The sensitive element in these sensors is the Hall transducer, which, to ensure low temperature drift, is performed on the basis of indium antimonide (InSb), as a material with a small band gap (0.17 eV at T = 300 K). So, the initial structure is an indium antimonide layer grown epitaxially on a gallium arsenide substrate. On the layer of indium antimonide deposited layer of adhesive layer of titanium, as a conductive layer, a layer of copper is deposited onto which, as a protective layer, a layer of titanium is deposited. Contradictory requirements are imposed on the deposited copper layer: it must be thick enough not to dissolve in the solder when soldering the leads, and at the same time it must be thin enough for easy removal when forming the metallization topology. Such requirements lead to the need for local copper electroplating.
Copper galvanic buildup is a critical operation requiring control of the coating thickness obtained by electrolysis. To obtain highquality sludge, when using acidic electrolytes based on CuSO4 and H2SO4, 6 experiments were conducted at different current densities, among which the optimum grain size was achieved at a current density of 2 A/dm2.

Pages: 37-51
References
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Date of receipt: 24 декабря 2018 г.