Article or book title, author's surname, DOI

Defect analysis and thermal characteristics decoder FPGA in their design and manufacture

A.V. Bashkirov1, N.N. Tolstykh2

research article Pages: 74-77

  1. 1 Ph.D. (Eng.), assistant professor of design and manufacture of radio, Voronezh State Technical University
  2. 2 Dr.Sci. (Eng.), Professor, head SPP31 JSC «Concern» Constellation»

Abstract

This paper analyzes the defects and thermal characteristics decoders implemented based on programmable logic integrated circuits . Working in digital data transmission systems with error-correcting coding . As analyzed object considered decoders located on one-and two-sided printed circuit board.

Possible reasons for failures occurring during the production release . The analysis of the technological component in the occurrence of latent and obvious defects.

A diagram of the relative distribution of overt and hidden defects detected during the scan decoders.

The analysis of numerical and analytical methods in calculating the spatial thermal fields decoders on mathematical models.

How to cite

Башкиров А.В., Толстых Н.Н. Анализ дефектов и тепловых характеристик декодеров на базе ПЛИС при их проектировании и производстве // Радиотехника. 2014. № 6. С. 74–77.

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