S.G. Vesnin1, S.I. Gorbunov2, A.A. Blinnikov3, D.A. Frolov4
1,3 Center for Microwave Diagnostics Development (Moscow, Russia)
2,4 National Research University Moscow Power Engineering Institute (Moscow, Russia)
1 vesnin47@gmail.com, 2 colzon@yandex.ru, 3 andrey@alexeyevich.ru, 4 FrolovDanA@mpei.ru
Traditional microstrip bandpass filters operating in the Ku-band suffer from high dissipative losses. The skin effect and radiation losses severely limit standard printed circuit board performance at these frequencies. Thus, there is an urgent need to develop highly selective printed devices with low insertion losses. This work aims to develop such printed bandpass filters for Ku-band applications using Substrate Integrated Waveguide (SIW) technology, effectively bridging the gap between planar circuits and bulky rectangular waveguides. The design process involved mathematical synthesis and electrodynamic modeling methods in specialized simulation software. The structures were excited using waveguide ports to ensure the highest accuracy in extracting scattering parameters. The proposed filter topologies utilize transverse slots in the top metal cover of the SIW cavity, creating transmission zeros and enhancing out-of-band rejection. A T-shaped equivalent circuit of the slotted SIW resonator was developed alongside empirical formulas for calculating its frequency-dependent impedances. The filters were designed on a domestic alumina ceramic substrate ("VK-100") with an exceptionally low dielectric loss tangent and minimal surface roughness, which is critical for the Ku-band. Topologies for third- to sixth-order bandpass SIW filters were synthesized. The theoretical models demonstrated excellent selectivity; the fifth-order SIW filter with a 2.4% fractional bandwidth exhibited a shape factor of 3.76 at the 50 dB level, with passband dissipative losses restricted to 2.47 dB. To validate this concept, a third-order SIW filter prototype was fabricated and tested. Experimental measurements showed outstanding agreement with computational models. After de-embedding the 0.5 dB losses from SMA connectors, the inherent dissipative insertion losses were 0.6 dB. This corresponds to an unloaded quality factor of approximately 380, significantly outperforming conventional hairpin microstrip filters. The measured frequency response closely followed the simulated data, confirming the equivalent circuit's validity. A slight passband narrowing at higher frequencies was attributed to the initial via hole spacing. Ultimately, the developed SIW structures demonstrate significant superiority in dissipative losses and selectivity. Their planar design allows seamless monolithic integration with other microwave components, leveraging standard batch manufacturing technologies to drastically reduce overall size and production costs for advanced Ku-band transceiver equipment.
Vesnin S.G., Gorbunov S.I., Blinnikov A.A., Frolov D.A. Ku-band bandpass SIW filters with transverse slots // Nanotechnology development and applications-XXI Ce. 2026. V. 18. № 3. P. 31−44. DOI: https://doi.org/10.18127/j22250980-202603-03
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