L.R. Kuznetsova1, L.N. Suchkova2, A.I. Chiyanova3

1–3 FSUE RFNC «All-Russian Research Institute of Experimental Physics» (Sarov, Russia)
1 Larisa.kuz0910@yandex.ru, 2 aСhiyanova@niiis.nnov.ru, 3 yatsan87@mail.ru

The level of technology development ensures the increasing use of multilayer printed circuit boards as the basic design basis of modern radio-electronic devices. Modern precision printed circuit boards contain in their structure such complex elements as blind and hidden metalized micro-transition, a conductive pattern with a conductor/gament ratio of up to 50/50 microns, etc.  The processes of manufacturing boards of this level of complexity require the solution of not one task, but involve an integrated approach to the development of technology that takes into account the interrelationship of all technological processes and the materials used.

The purpose of the work is to obtain a conductive pattern of the inner and outer layers of multilayer printed circuit boards, corresponding to the 6th accuracy class.

During the research, the factors affecting the quality and accuracy of obtaining a conductive pattern of the 6th accuracy class were identified, the results of etching the pattern with a conductor/gaper ratio of 75/75 microns were presented.

The developed technological solution allow you to manufacture precision multilayer printed circuit boards for new generation devices, increasing their performance, compactness, energy efficiency and functionality.

Kuznetsova L.R., Suchkova L.N., Chiyanova A.I.  Factors affecting the production of a conductive pattern of multilayer printed circuit boards of accuracy class 6 // Achievements of modern radioelectronics. 2026. V. 80. № 8. P. 59–67. DOI: https://doi.org/10.18127/j20700784-202608-08

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