Preparation of inside layers of printed circuit boards for surface mount technology

М.S. Moskovskih; L.V. Ipat-eva; А.P. Lebedev; А.А. Levitskiy

Preparation of inside layers of printed circuit boards for surface mount technology

М.S. Moskovskih¹, L.V. Ipat-eva², А.P. Lebedev³, А.А. Levitskiy⁴

research article Pages: 54-58

^1,2,3 JSC «Academican M.F. Reshetnev «Information Satellite Systems», Zheleznogorsk
⁴ Siberian Federal University, Krasnoyarsk

Keywords: multilayered printed-circuit boards technology of printed-circuit boards

Abstract

The analysis of the tests results of adhesion strengthening process USAD-1100 in the production of multilayered printed-circuit boards is submitted. Printed-circuit boards were exposed to different types of tests for confirmation of their production quality and check in modes of installation and possibility of ready PCB repair. Tests were made with use of special processing equipment. Control was exercised by means of the equipment of the optical control, the automated tester, by research metallo-graphic thin sections. The analysis of the results shows that multilayered printed-circuit boards, made with use of process of USAD-1100, meet requirements of standard technical documentation.

How to cite

Московских М.С., Ипатьева Л.В., Лебедев А.П., Левицкий А.А. Технологическая подготовка внутренних слоев печатных плат для поверхностного монтажа элементов // Успехи современной радиоэлектроники. 2015. № 1. С. 54–58.

References

Tereshkin V., Grigoreva L. Povyshenie adgezii sloev mnogoslojjnykh pechatnykh plat putem modifikacii poverkhnosti s organometallicheskim pokrytiem // Tekhnologii v ehlektronnojj promyshlennosti. 2011. № 3. S. 36-39.

[1] Tereshkin V., Grigoreva L. Povyshenie adgezii sloev mnogoslojjnykh pechatnykh plat putem modifikacii poverkhnosti s organometallicheskim pokrytiem // Tekhnologii v ehlektronnojj promyshlennosti. 2011. № 3. S. 36-39.