M. M. Migalin1, V. A. Obukhovets2, V. V. Demshevsky3
1, 2 Southern Federal University (Taganrog, Russia)
3 Branch of MIREA – Russian Technological University (Fryazino, Russia)

1 migalin@sfedu.ru

The rapid evolution of wireless communication technologies, particularly the rollout of 5G and emerging 6G systems, is driving the integration of devices operating in the millimeter-wave frequency range. This transition presents new challenges in the design and manufacturing of radio-frequency components such as printed antennas and substrate integrated waveguide (SIW) resonators. These devices, favored for their compact size, high performance, and ease of integration, are widely used in miniaturized mobile terminals and high-capacity base stations. However, due to their small geometries and tight design constraints, even minor production deviations can significantly alter their electromagnetic performance, affecting key figures of merit such as resonant frequency, quality factor, and coupling efficiency.

This study investigates how common fabrication-induced geometric variations affect the resonant and transmission properties of SIW resonators and printed antennas produced using PCB technology. Optical measurements have been first conducted to determine actual manufacturing deviations in via placement, metallization thickness, and etching accuracy. Electromagnetic simulations have been then used to evaluate the sensitivity of key device parameters to these variations and to quantify their impact on electromagnetic behavior across relevant frequency range.

For single-mode SIW resonators, the results have revealed that misalignment of metallized vias can cause resonant frequency shifts exceeding 5 GHz, indicating high sensitivity. In contrast, rounding of excitation slot corners had a much smaller impact, with frequency shifts limited to under 100 MHz. In multimode resonators, excitation slot misalignment up to 65 µm led to frequency deviations of over 200 MHz, while doubled copper cladding thickness did not have any significant effect.

For printed antennas designed using a genetic algorithm, dimensional deviations of feeder lines and quarter-wave transformers reached up to 14%, but these deviations had minimal influence on the transmission coefficient between patches. However, variations in the size of metallic decoupling structures, or “pixels”, on the dielectric layers were far more consequential. Scaling pixel dimensions by ±20% resulted in changes of up to 13 dB in the transmission coefficient across the operating band.

These findings highlight the design features most susceptible to manufacturing tolerances and provide actionable guidance for robust, repeatable mass production of millimeter-wave components.

Migalin M.M., Obukhovets V.A., Demshevsky V.V. Manufacturing processes influence on millimeter-wave printed antennas and resonators characteristics. Antennas. 2025. № 4. P. 62–72. DOI: https://doi.org/10.18127/j03209601-202504-06 (in Russian)

1. Koul S.K., Karthikeya G.S. Millimeter wave antennas for 5G mobile terminals and base stations. Boca Raton, FL: CRC Press. 2020.
2. Röhrl F.X. et al. Cost-effective SIW band-pass filters for millimeter wave applications a method to combine low tolerances and low prices on standard PCB substrates. 2017 47th European Microwave Conference (EuMC). Nuremberg, Germany. 2017. P. 416–419. DOI: 10.23919/EuMC.2017.8230878.
3. Coonrod J. The effects of PCB fabrication on high-frequency electrical performance. IPC APEX EXPO Conference Proceedings. 2016. P. 10.
4. Zhai W., Miraftab V., Repeta M. Broadband antenna array with low cost PCB substrate for 5G millimeter wave applications. Global Symposium on Millimeter-Waves (GSMM). IEEE. 2015. P. 1–3.
5. Kim C. et al. 5G mmWave patch antenna array on extremely low loss alumina ribbon ceramic substrates for antenna-in-packaging (AiP). 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). IEEE. 2023. P. 492–497.
6. Ferrando-Rocher M. et al. Selective laser sintering manufacturing as a low cost alternative for flat-panel antennas in millimeter-wave bands. IEEE Access. 2021. V. 9. P. 45721–45729.
7. Addamo G. et al. 3-D printing of high-performance feed horns from Ku-to V-bands. IEEE Antennas and Wireless Propagation Letters. 2018. V. 17. № 11. P. 2036–2040.
8. Wei F. et al. A circularly polarized 3-D printed dielectric transmitarray antenna at millimeter-wave band. IEEE Antennas and Wireless Propagation Letters. 2021. V. 20. № 7. P. 1264–1268.
9. Vargas P.E. et al. Fabrication and characterization of 3D printed mmWave RF devices. 2025 19th European Conference on Antennas and Propagation (EuCAP). IEEE. 2025. P. 1–5.
10. Almeshehe M. et al. Surface roughness impact on the performance of the 3D metal printed waveguide coupler at millimeter wave band. Engineering Science and Technology. 2022. V. 35. P. 101129.
11. Migalin M.M., Obukhovets V.A. Opredelenie parametrov fol'girovannykh dielektrikov s pomoshch'yu pechatnykh struktur. Izvestiya YuFU. Tekhnicheskie nauki. 2024. № 6 (242). S. 257–266. DOI: 10.18522/2311-3103-2024-6-257-266. (in Russian)
12. Migalin M.M., Obukhovets V.A. Snizhenie vzaimnoj svyazi pechatnykh antennykh elementov s pomoshch'yu geneticheskogo algoritma. Antenny. 2024. № 3 (289). S. 65–74. DOI: 10.18127/j03209601-202403-08. (in Russian)