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Journal Antennas №9 for 2013 г.
Article in number:
Minimizing the side lobes level in antenna arrays with the spatial of elements arrangement
Keywords: spatial arrays hexagonal structure of the element arrangement the energy potential of the antenna array
Authors:
E.V. Ovchinnikova -C.Sc. (Eng.), Associate Professor of Department of Radiophysics, Antennas and Microwave Technique of Moscow Aviation Institute. E-mail: oea8888@gmail.com
S.G. Kondrat-eva -postgraduate student of Department of Radiophysics, Antennas and Microwave Technique of Moscow Aviation Institute. E-mail: evolventa5@yandex.ru
P.A. Shmachilin - C.Sc. (Eng.), Senior Teacher of Department of Radiophysics, Antennas and Microwave Technique of Moscow Aviation Institute. E-mail: shmachilin@gmail.com
Abstract:
Currently there are rather strict requirements to antenna systems: a high energy potential of the limited aperture size and the low side radiation level. Typically, the weight and size characteristics limit appears during designing of avionics systems (RES) for different purposes. Active phased array (AESA) with the spatial distribution of elements and digital beamforming is perspective direction of creating on-board antenna systems. In the spatial array antennas UBL is only reduced by the optimal allocation of emitters in space, thus the number of elements and the size of the equivalent aperture will be saved, so the value of CPV in any UBL will not be lesser than the CPV for a flat AR with uniform amplitude distribution. UBL decline depends on the spatial function placement of elements in the hexagonal array antenna, so they can be applied to different forms of element accommodation in space: pyramidal, parabolic, spherical, etc. Reducing the level of the side lobe antenna arrays without changing the gain extends the functionality of the AR: increases positioning accuracy, noise immunity and energy potential. Such arrays can be implemented on modern digital components using new methods and technologies for the manufacture of aerial fabric, such as galvanoplastics (electroforming) technology.
Pages: 15-22
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