350 rub
Journal Antennas №3 for 2013 г.
Article in number:
Mutual arrangement of metal conductors of integrated on-chip triangular dipoles
Keywords: integrated dipoles antenna-on-chip technological metallization depth of the antenna radiation pattern control
Authors:
M.O. Suslov, A.V. Tikhomirov
Abstract:
The article is devoted to the properties of integrated antennas study in millimeter wavelengths and dedicated to improve future telecommunication systems, which integrated microwave antenna is the main component. Integrated antennas with symmetrical triangle-vibrators are considered. Simulation of this antenna is made for various geometric realizations and different mutual locations. Features of integrated on-chip antenna production were taken into account. Significant influence of location and antenna shape on radiation pattern in E- and H- planes, matching, and radiation efficiency is shown. The study is done for EHF band antennas operating at 148 GHz. Simulation results indicate that integrated symmetrical triangle antennas have reflection coefficient of - 7,3 dB, radiated power of 27 %, radiation efficiency of 20 %, gain - 19 dB and beam width 105. These antennas can be implemented in telecommunication systems based on CMOS technology with gigabit data rates, and can be used e.g. for data transfer between different integrated circuits on a single printed circuit board or between different blocks inside a system-on-chip.
Pages: 31-35
References
  1. Rubinshtejjn JA.M.Rasprostranenie radiovoln i antenno-fidernye ustrojjstva. L.: Morskojj transport. 1960.
  2. Rodionov V.M. Linii peredachi i antenny UKV. M: EHnergija. 1977.
  3. Panchenko B.A., Nefedov E.I. Mikropoloskovye antenny. M.: Radio i svjaz. 1986.
  4. Behdad N., Shi D., Hong W., Sarabandi K., Flynn M.P. A 0,3 mm2 miniaturized X-band on-chip slot antenna in 0,13 um CMOS // IEEE RFIC Symposium Digest, 2007. P. 441-444.
  5. Suslov M.O., Timoshenko A.G. Osobennosti realizacii integralnykh antenn dlja sistem radiochastotnojj identifikacii // Tezisy dokladov SHestojj otraslevaja nauch. konf. «Tekhnologii informacionnogo obshhestva». M.: MTUSI. 2012. S. 150.
  6. Ogawa E.T., Kim J., Haase G.S., Mogul H.C., McPherson J.W. Leakage, breakdown, and TDDB characteristics of porous low-k silicabased interconnect dielectrics // Proc. IRPS 2003. P. 166-172.
  7. Boss H. Demystifying Signal and Power Integrity // IEEE Microwave Magazine, Aug. 2011. P. 6-10.
  8. Suslov M.O. Integralnye antenny na kristalle po tekhnologii KMOP // Tezisy dokladov 19-jj konf. studentov i aspirantov «Mikroehlektronika i informatika ? 2012». M.: MIEHT. 2012. C. 231.
  9. Suslov M.O., Timoshenko A.G., Lomovskaja K.M. K osobennostjam realizacii integralnykh planarnykh antenn dlja RCHI sistem // Sb. nauchnykh trudov SWorld. Po materialam mezhdunarodnojj nauch.-prakticheskojj konf. «Nauchnye issledovanija i ikh prakticheskoe primenenie. Sovremennoe sostojanie i puti razvitija ʻ2012». Odessa: CHernomore. 2012. Vyp. 3. T. 11. S. 88-95.
  10. Timoshenko A.G., Lomovskaja K.M., Suslov M.O. Issledovanie osobennostejj integralnykh antenn // Sb. trudov V Vserossijjskojj nauch.-tekhn. konf. «Problemy razrabotki perspektivnykh mikro- i nanoehlektronnykh sistem - 2012», oktjabr 2012. S. 338-343.