D. N. Repnev, N. V. Saratovsky, M. N. Ushkar

The object of the present study is the analysis of thermal conditions of electronic means by means of CAD SolidWorks. The aim of the paper is to improve the efficiency of engineering analysis of thermal conditions of electronic means constructions by means of CAD SolidWorks, through the agency of developing the library of thermal macro-level models LSI and VLSI. Methodology of the study is connected with the analysis of the modern element base and also connected with identification of the most utilizable types of bodies. For the chosen types of bodies, LSI and VLSI, the present study provides the analysis of the body structure, thermal circuit and mathematical description. For every type of the body, with the help of the received mathematical description there can be calculated the following: total heat conduction, coefficients showing the influence of each element on the total heat conduction and power dissipation in every branch of the circuit. Afterwards, the elements of the thermal circuit which influence significantly on the resultant value of total heat conduction, are chosen; and only based on that it is possible to work out a simplified thermal circuit. On the basis of the simplified thermal model with the help of CAD SolidWorks a solid macro-level model is created. In order to check the model adequacy the following experiments are conducted: the calculation of the real FC, and also the comparison of the real thermal resistance drags with the results of SolidWorks calculation. The result of the study is the library of thermal macro-level models LSI and VLSI upon condition on maintaining given accuracy of the solution. The library of thermal macro-level models usage allows to reduce costs of computer time. The developed library can be widely useful for solving the cases connected with engineering analysis of thermal conditions of electronic means.