350 rub
Journal Science Intensive Technologies №8 for 2011 г.
Article in number:
Failure analysis of electronic components аnd integrated circuits
Authors:
V.A. Smetannikow
Abstract:
The paper demonstrates how the failure analysis of electronic components is conducted, and what can be learnt from the investigation. Typical failure symptoms are discussed. The paper is a result of estimation of taken investigations and of failures categorization by types. The examples of failure analysis of electronic components are shown. They illustrate the wide range of undertaken work and the nature of many investigated failures. To avoid repetitions of failures and thereby to raise the reliability of products the got information was sent to production departments. This paper will help engineers, working in the field of failure analysis, to choose the right investigation technique, so will reduce the time spent on determination and analysis of failures.
Pages: 68-70
References
  1. Smith C.A. The application of X-rays in the failure analysis of electronic devices and systems // Circuit World. 2008. V. 34. № 3. Р.  31 - 39.