A.A. Zhilenkov1, V.A. Lozhkin2

1,2 Saint Petersburg State Marine Technical University (St. Petersburg, Russia)

1zhilenkovanton@gmail.com, 2vlad@lozhkin.su

The development of modern electronics increases the requirements for the quality and efficiency of soldering processes, including in robotic assembly and disassembly of electrical engineering products. In selective soldering, it is critical to ensure a specified temperature profile and repeatability of the process, reducing the influence of external factors and preventing deviations in heating and cooling times. To develop a control system for an automatic selective soldering tool for a robotic cell intended for assembly and disassembly of electrical engineering products, providing optimal control of the thermal regime and maintaining a specified temperature profile. A microcontroller-based control system is proposed, with the ability to regulate the inverter duty cycle via pulse-width modulation to form the required thermal regime. It is shown that the developed approach makes it possible to select the optimal time to reach the temperature profile, maintain temperature stability, and control heating and cooling times. The proposed solution can be used in robotic assembly-disassembly cells to improve soldering repeatability and reduce the influence of external factors on joint quality.

Zhilenkov A.A., Lozhkin V.A. Automated soldering system for robotic cell for assembly and disassembly of electrical products. Electromagnetic waves and electronic systems. 2026. V. 31. № 2. P. 46−58. DOI: https://doi.org/10.18127/j15604128-202602-06 (in Russian)

1. Lee Ning-Cheng. Reflow soldering technology, defect detection and elimination: surface mounting, BGA, CSP and flip chip technologies. Moscow: Technologies. 2006. 392 p. (in Russian)
2. Kukowski J.A., Ricci J.G., Carollo F.L. Odd-form assembly. 2000.
3. Al-Araji Zainab Hussam Mosa, Bobylkin I.S., Turetsky A.V., Pirogova Yu.A., Khoroshailov R.N. Methodology for choosing the optimal layout of multilayer printed circuit boards taking into account external mechanical influences. Radiotekhnika. 2023. V. 87. № 8. P. 89−93. DOI 10.18127/j00338486-202308-14. (in Russian)
4. Moskovskikh M.S., Ipatieva L.V., Lebedev A.P., Levitsky A.A. Technological preparation of the inner layers of printed circuit boards for surface mounting of elements. Achievements of modern radioelectronics. 2015. № 1. P. 54–58. (in Russian)
5. Grebenyuk A.I. THT and OFA – installation technologies for critical applications. Informatization and control systems in industry. 2021. № 5(95). P. 77–81. (in Russian)
6. Lanin V.L., Parkovsky V.V. Application convection and infrared heating sources for mounting and demounting of electronic modules. Electronic processing of materials. 2009. № 6(260). P. 86–91. (in Russian)
7. Lanin V.L., Artyukhevich E. The use of thermal air stations during the installation and disassembly of electronic components. Technologies in the electronic industry. 2016. № 3(87). P. 56–59. (in Russian)
8. Lanin V.L., Parkovsky V.V. Installation and dismantling of BGA, CSP, Flip-Chip, QFP using infrared radiation and convection heating. Technologies in the electronic industry. 2011. № 1(45). P. 28–31. (in Russian)
9. Ammons J.C., Carlyle W.M., DePuy G.W., Ellis K.P., McGinnis L.F., Tovey C.A., Xu H. Computer-aided process planning in printed circuit card assembly. IEEE Transactions on Components, Hybrids, and Manufacturing Technology. 1993. V. 16. № 4. P. 370–376. DOI 10.1109/33.237929.
10. Ji P., Wan Y.F. Planning for printed circuit board assembly: The state-of-the-art review. International Journal of Computer Applications in Technology. 2001. V. 14. № 4-6. P. 136–144. DOI 10.1504/IJCAT.2001.000268.
11. Lanin V.L., Lappo A. Microcontroller control of temperature profiles of assembly soldering of electronic modules. Technologies in the electronic industry. 2015. № 6(82). P. 47–50. (in Russian)
12. Lozhkin V.A. Application of computer vision systems with industrial robots. Proceedings of Tula State University. Technical sciences. 2024. № 1. P. 343–347. DOI 10.24412/2071-6168-2024-1-343-344. (in Russian)
13. Milecki A., Regulski R., Sędziak D., Owczarek P., Proch Z. Application of Computer System in Control and Programming of a Robotized Soldering Station. MATEC Web of Conferences. 2019. V. 252. № 4-6. P. 02008 DOI 10.1051/matecconf/201925202008.
14. Dimok F. DiMatteo R. Achievement and control of cooling values in reflow furnaces. Production of electronics: technologies, equipment, materials. 2008. № 4. P. 51–54. (in Russian)
15. Tikhankin A., Shmakov M. Optimization of the temperature profile of soldering printed circuit boards by reflow. Technologies in the electronic industry. 2008. № 1(21). P. 44–46. (in Russian)
16. Lee P., Kherdin M. Selection, design and calculation of the snubber circuit. Power electronics. 2022. № 2(95). P. 8-11. (in Russian)
17. Certificate of state registration of a computer program № 2024686546 dated 11.11.2024. A program for monitoring the dependence of external temperature on time with an unchanged PWM signal of a soldering station. Zhilenkov A.A., Lozhkin V.A. (in Russian)