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Journal Electromagnetic Waves and Electronic Systems №6 for 2024 г.
Article in number:
Attenuation of reflected UHF wave by planar metamaterial structure with the addition of an active absorbing thin film layer
Type of article: scientific article
DOI: 10.18127/j5604128-202406-08
UDC: 537.876.4
Authors:

A.S. Mazinov1, N.A. Boldyrev2, V.M. Vasilchenko3, A.V. Starosek4

1–4 V.I. Vernadsky Crimean Federal University (Simferopol, Republic of Crimea, Russia)

1 mazinovas@cfuv.ru, 2 kolyaboldyrev@gmail.com, 4 starosekav@cfuv.ru

Abstract:

Due to the growing number of mobile phone users and busy cellular communications, the control of background electromagnetic radiation and methods of its reduction is an urgent task. On the other hand, development of coatings that provide low radio visibility is in demand in many civil and industrial facilities. The present work is aimed at developing compact attenuating coating using a combination of planar metastructures with thin nanoscale conductive films, which can be used as protective material, reducing the level of transmitted electromagnetic radiation with a small reflection coefficient in the K-band. Proposed metastructure utilized a pattern of counter-directed pairs of triangle spirals. For dissipative film, a 5 nm think aluminum film on glass substrate was used. Attenuation of the reflected wave at the level of 20 dBm in the whole frequency range considered relative to the metal mirror was experimentally achieved. Experimental and theoretical frequency characteristics of the studied structures were obtained, as well as backscattering diagrams for different angles of wave incidence in the anechoic chamber. Both analytical and modeling pictures of the field distribution on the surface of the metastructure resonators were also obtained.

Pages: 64-69
For citation

Mazinov A.S., Boldyrev N.A., Vasilchenko V.M., Starosek A.V. Attenuation of reflected UHF wave by planar metamaterial structure with the addition of an active absorbing thin film layer. Electromagnetic waves and electronic systems. 2024. V. 29. № 6. P. 64−69. DOI: https://doi.org/10.18127/j15604128-202406-08 (in Russian)

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Date of receipt: 20.12.2024
Approved after review: 23.12.2024
Accepted for publication: 24.12.2024