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Journal Electromagnetic Waves and Electronic Systems №1 for 2016 г.
Article in number:
Technique produce raw materials for electronic components electronic production
Keywords: Hydrocarbonyl method carbonyl copper (I) copper powder grain size composite heat sinks a laser particle analyzer
Authors:
A.P. Korzhavyi - Dr. Sc. (Eng.), Professor, Kaluga branch of the Bauman MSTU. E-mail: fn2kf@list.ru V.V. Maximov - Senior Lecturer, Kaluga branch of the Bauman MSTU. E-mail: fn2kf@list.ru V.O. Fedorov - Ph. D. (Eng.), Associate Professor, Kaluga branch of the Bauman MSTU. E-mail: wquolz@mail.ru
Abstract:
Fine powders of copper in high demand for the electronic components manufacture. It is above all necessary for the implementation of new manufacturing technologies for composite heat sink temperature stabilization elements durable vacuum and semiconductor microwave technology. Material for heat sinks are typically compositions tungsten - copper, molybdenum - copper, obtained by rolling a mixture of powders by their deformation and subsequent sintering. Equipment for producing fine fractions of copper laborious, which determines their high cost. This paper describes the study and the preparation and particle size distribution of the diagnosis of high-purity powders of copper from copper-containing liquid waste electronics and instrument-making enterprises. The presence of such enterprises chemical laboratories and chemical-analytical units allow you to organize workshops in the subsidiary to obtain the required solutions for the implementation of the process of catalytic reduction. The starting raw material for the preparation of such solutions are copper-containing liquid waste from the activities of the main workshops of radio electronics and instrument (from the copper plating technology products, their etching and others.). Integration into the manufacturing process, in its final stage, laser particle size analyzer such as «LASKA-1K» allows precise control of particle size distribution of copper powders. These powders are used directly on the copper electronics companies in the manufacture of materials molybdenum-copper, copper-tungsten by rolling the powders from which the composition and produce a new type of heat sink.
Pages: 9-14
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