350 rub
Journal Electromagnetic Waves and Electronic Systems №3 for 2014 г.
Article in number:
Analysis of the destruction of polymer materials electronics in spatially inhomogeneous temperature fields consider
Keywords: electronic equipment temperature fields reliability destruction polymeric materials
Authors:
G.V. Kuznetsov - Dr. Sc. (Phys.-Math.), Professor, Department «Thermal Theory and Engineering», National Research Tomsk Polytechnic University
E.V. Kravchenko - Ph. D. (Eng.), Associate Professor, Department «Thermal power process automation», National Research Tomsk Polytechnic UniversityE-mail: kevatp@tpu.ru
Abstract:
Spatial modeling of unsteady temperature fields in a typical PCA electronic equipment provided convective and radioactive heat exchange with the environment are conducted. Spatial heat equation solved by the FEM method. In solving the three-dimensional analogue of heat equations are splitting scheme applied. Solutions obtained one-dimensional difference equations used sweep method using a four points implicit finite difference scheme approximation. In the numerical studies in this paper were identified level of degradation (aging) of a typical polymeric material - fiberglass considering spatial inhomogeneity of the temperature field printed electronics. It was found that the operating time of five years, the level of degradation of the polymer composite material was approximately 25% of the initial value. This result suggests the need to include heterogeneous spatial temperature fields in the estimates of the degree of degradation of polymeric materials for long term use of electronics, as well as the need to consider the aging of polymers in determining indicators of reliability of electronic equipment.
Pages: 4-12
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