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Journal Dynamics of Complex Systems - XXI century №5 for 2013 г.
Article in number:
Accelerated Simulation of Thermal and Mechanical Reliability of Electronic Devices and Circuits. Example of an integrated circuit simulation in ASONIKA-M-3D
Keywords: microcircuit simulation mechanical processes thermal processes
Authors:
A. Shalumov - General Director of «Scientific research institute» ASONIKA» (Russia), Dr. Sc. (Eng.), Professor, the academician of the International academy of information, the winner of the award of the Government of the Russian Federation in the field of a science and the technics, managing chair of information technology of Vladimir branch RANHiGS (Russia). E-mail: ALS140965@mail.ru
E. Pershin - Ph. D., Research Assistant of «Scientific research institute» ASONIKA» (Russia)
Аnatoly Korkin - Professor-researcher, Arizona State University, Tempe, AZ (USA)
Valeriy Khaldarov - Mechanical and Aerospace Engineering, Arizona State University, Tempe, AZ (USA)
Abstract:
In article questions of the accelerated modelling of thermal and mechanical processes in integrated microcircuits are considered. The modelling example is resulted.
Pages: 59-67
References

 

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