Structural Electrical Model of Electrostatic Discharge on Microelectronic Equipment Assembly

The aim of this article is development of structural electrical model of electrostatic discharge to electronic equipment assembly during the repair. The analysis of equivalent circuit of known discharge model from operator body to electronic device package was fulfilled in the article. It is shown, by model conductor system capacitance calculation, that capacitance between operator arm and receptor - assembly communication line can be excluded. Also it is shown, that discharge occur on characteristic wave impedance of assembly communication line in investigated case. Calculation of transient processes in equivalent circuit of the obtained model is fulfilled. Results from calculation, that disturbance voltage impulses in equivalent circuit of electrostatic discharge on electronic equipment assembly is differ from discharges impulses on electronic hardware components package, which usually being considered.