K.A. Malinovskiy1, A.R. Safin2, A.V. Belyaev3

1,2 National Research University “Moscow Power Engineering Institute” (MPEI) (Moscov, Russia)

1,2 V.A. Kotelnikov Institute of Radio Engineering and Electronics (Moscow, Russia)

3 Moscow Aviation Institute (National Research University) (Moscow, Russia)

¹ malinovskiykostya@yandex.ru; ² arsafin@gmail.com; ³ abv@a2dyn.ru

The modern electronic equipment (EE) design system is characterized by a drive towards higher packaging density, miniaturization, and reduced "design-to-production" cycles. Traditional subtractive (positive and negative) methods of lithography and chemical etching demonstrate low efficiency at the prototyping stage and limit the possibility of implementing topologies on surfaces with complex geometric shapes. Additively Manufactured Electronics (AME) represents a promising alternative, enabling the selective deposition of conductive and dielectric structures on flexible, ceramic, and 3D substrates. The aim of this work is to systematize and compare methods for the additive formation of electronic units, focusing on the electrophysical parameters of the resulting structures applicable in the microwave range. Unlike existing reviews, this paper provides a comprehensive evaluation of the applicability of AJP, DIW, and InkJet methods, taking into account the domestic technological base, the objectives of material import substitution, and the requirements for functional units of new-generation radio engineering systems.

The paper provides a detailed review of the physical principles behind inkjet, aerosol, and microdispensing (Direct Ink Writing) technologies. For inkjet printing, the physics of drop formation, defined by the Ohnesorge number, and the synchronization of simultaneous polymer UV-curing and metal thermal sintering are discussed. Aerosol Jet Printing (AJP) is analyzed in terms of ultrasonic and pneumatic atomization, highlighting the Konovalov effect for ultrasonic activation of highly viscous nanoinks, as well as aerodynamic focusing, which allows high-resolution printing on 3D surfaces with significant height variations due to the high inertia of microdroplets in a laminar flow. The Direct Ink Writing (DIW) method is examined by focusing on the rheology of non-Newtonian fluids (pseudoplasticity and thixotropy) and precision hardware solutions, such as the active suck-back valve used to prevent tailing. Furthermore, the complexities of 5-axis kinematics and interpolation algorithms for 3D Molded Interconnect Devices (3D-MID) are highlighted.

The study also evaluates the applied materials, including conductive nanoinks (silver, copper, gold) and composites for fully printed active and passive components. Special attention is given to the physicochemical processes of post-processing. The hydrodynamics of drying and the elimination of the "coffee ring" effect via the Marangoni effect are described. The thermodynamics of nanoparticle sintering (including stabilizer desorption, necking, and densification) are analyzed alongside the advantages of Intense Pulsed Light (IPL) photonic sintering, which allows for rapid, room-temperature processing of copper inks without oxidizing the metal or melting the polymer substrates.

A comparative analysis evaluates the constraints of printing methods based on domestic industry capabilities, material viscosity, resolution, and 3D fabrication potential. The study formulates an integrated physical picture linking precision deposition, rheological activation, and nanoparticle coalescence, outlining promising applications for microwave 3D filters, phased antenna arrays, and integrated conductive paths using domestic pastes.

Malinovskiy K.A., Safin A.R., Belyaev A.V. Additive technologies for forming functional units of electronic equipment // Radiotekhnika. 2026. V. 90. № 8. P. 147−159. DOI: https://doi.org/10.18127/j00338486-202608-14

1. Tuev V.I. Additivnye tekhnologii proizvodstva ustrojstv radioelektroniki: Uchebnoe posobie. Tomsk: Izd-vo TUSUR. 2020. 90 s. (in Russian).
2. Kablov E.N. Additivnye tekhnologii: perspektivy 3D-pechati v promyshlennosti. Atomnyj ekspert. 2014. № 56. S. 5661 (in Russian)
3. Yuhnovec A.V. Tekhnologii additivnogo formirovaniya kommutacionnyh struktur [Elektronnyj resurs]. Repozitorij BGUIR. 2021 (in Russian).
4. Franke J. (Ed.) Three-Dimensional Molded Interconnect Devices (3D-MID). Munich: Hanser Publications. 2014.
5. Cui H. et al. Direct writing of flexible electronics: from materials to applications. Journal of Materials Chemistry C. 2020.
6. Jeevan E. Aerosol jet-printed sensors for aero-engine component health monitoring. Aeronautics - Characteristics and Emerging Technologies. 2024.
7. Gülcan O. et al. The state of the art of material jetting: a critical review. Polymers. 2021.
8. Bokobza L. Mechanical properties of polymer nanocomposites. Polymers. 2019. V. 11. Is. 2.
9. King B.H., Wilkinson J.M. Aerosol jet® direct write printing for mil-aero electronic applications. IMAPS. 2009.
10. Konovalov E.G., Garamovich V.N. Ul'trazvukovoj kapillyarnyj effekt. Doklady AN BSSR. 1961. T. 5. № 11. S. 496498 (in Russian).
11. Xiong Z. et al. Enhanced aerosol-jet printing using annular acoustic field for high resolution and minimal overspray. Nature Communications. 2024.
12. Hoeng J. et al. State-of-the-art methods and devices for generation, exposure, and collection of aerosols from e-vapor products. Toxicology Research and Application. 2020.
13. Agarwala S. et al. Aerosol-jet-printed preferentially aligned carbon nanotube twin-lines for printed electronics. ACS Applied Materials & Interfaces. 2019.
14. Mahajan A. et al. Aerosol-based direct-write of conductive, additive-free silver lines. Journal of Materials Chemistry C. 2013.
15. Secor E.B. et al. Traceable characterization of aerosol jet printing via high-speed imaging. Flexible and Printed Electronics. 2014.
16. Zhang Z. et al. Current progress on the 3D printing of thermosets. Advanced Composites and Hybrid Materials. 2020.
17. Church K.H. et al. Method and apparatus for dispensing viscous materials. U.S. Patent No. 6,760,996. Publ. 2004.
18. Datar A. Micro-extrusion Process Parameter Modeling. Master of Science - Industrial Engineering. 2012.
19. Staharnyj S.V. Perspektivy organicheskih svetodiodov v sistemah osveshcheniya. Sovremennaya svetotekhnika. 2010. № 3. S. 2330 (in Russian).
20. Nassar J.M. et al. Paper skin multisensory platform. Advanced Materials Technologies. 2016.
21. Giannakou P. Printed transition metal oxide electrochemical capacitors for energy harvesting applications. ResearchGate. 2021.
22. Deegan R.D. et al. Capillary flow as the cause of ring stains from dried liquid drops. Nature. 1997. V. 389. P. 827829.
23. Hu H., Larson R.G. Marangoni effect reverses coffee-ring depositions. Journal of Physical Chemistry B. 2006.
24. Buffat P., Borel J.P. Size effect on the melting temperature of gold particles. Physical Review A. 1976. V. 13. № 6. P. 2287.
25. Babalola B.J. et al. Sintering of nanocrystalline materials: sintering parameters. Heliyon. 2023.
26. Dhage S. et al. Intense pulsed light sintering of copper nanoink for printed electronics. Applied Physics A. 2009.
27. Jabari E. et al. 2D printing of graphene: a review. 2D Materials. 2019.
28. Hedges M. 3D aerosol jet printing adding electronics functionality to RP/RM. DDMC Conference. Berlin, 2012.
29. Friedman M. et al. 3D printed high-performance RF components. IEEE Access. 2019.
30. Greer J.R., Street R.A. Thermal cure effects on electrical performance of nanoparticle silver inks. Acta Materialia. 2007.
31. Flowers P.F. et al. 3D printing electronic components and circuits with conductive thermoplastic filament. Additive Manufacturing. 2017. V. 18. P. 156-163.