Mathematical model of double-sided polishing of a group of simultaneously processed silicon wafers

The production of modern solid-state integrated circuits uses silicon semiconductor wafers as a blank. The accuracy of the geometric shape of the plates required for this is ensured during finishing polishing operations. The most productive is the double–sided polishing of a group of work pieces on the machine. The calculation of the evolution of the geometric shape of the plate during such processing requires the development of a mathematical model of pressure distribution, which depends on the distribution of the workload between the work pieces of the same group during their joint processing on the machine.

Objective – to develop a mathematical model of double-sided polishing of a group of simultaneously processed silicon wafers. A mathematical model of double-side polishing of a group of simultaneously processed silicon wafers allowing to calculate the workload for each wafer has been developed.

Practical significance – the use of the research results allows us to develop a mathematical model of the process of double-sided polishing on a machine of a group of silicon wafers and calculate the optimal technological modes of this operation.