Models and algorithms for estimating the probability of trouble-free operation of multilayer printed circuit boards under probabilistic thermal influences

The use of active cooling systems in the design of modern electronic equipment is impossible due to limited mass and size characteristics and the potting with polymer compounds. To normalize the thermal operating conditions, multilayer printed circuit boards (PCBs) with heat-dissipating layers are used. These are metallized layers in contact with the casing, which acts as a continuous foil-coated radiator. The probabilistic nature of thermal operating conditions, as well as the design features of modern electronic equipment, require the development of new mathematical models and calculation approaches for assessing the probability of failure-free operation.

The objective of the work is to develop an approach for assessing the probability of failure-free operation of multilayer printed circuit boards under thermal exposure, taking into account the stochastic nature of the thermal properties of construction materials, the influence of heat-dissipating layers, the random area of metallization across layers and the geometric dimensions of the boards, and the probabilistic nature of the applied thermal loads.

The result of the work is methodological and algorithmic support for assessing the probability of failure-free operation of multilayer printed circuit boards, as well as developed software. The practical significance of the work is determined by the proposed model for assessing the probability of failure-free operation, implemented using the statistical modeling method, with the calculation of the multilayer PCB structure state parameter based on the author's model of an equivalent material.