A.D. Dorogov1, M.M. Ivoylova2, N.S. Kornev3, A.V. Nazarov4, R.R. Osmanov5, V.A. Shulpin6

1–6 FSUE RFNC «All-Russian Research Institute of Experimental Physics» (Sarov, Russia)
1 aethnos-nn@yandex.com, 2 maria.ivoilowa@yandex.ru, 3 korneff15@rambler.ru, 4 nazarov52@mail.ru, 5 osmanov22ruslan@mail.ru, 6 vladshu@list.ru

When developing millimeter-wave radar sensors, reducing their weight, size, and cost is a pressing issue. The key component of any radar sensor is the transceiver module. The most promising approach to developing a radar sensor's transceiver module is the use of compact components in the form of microwave monolithic integrated circuits (MMIC). The use of MMIC significantly improves manufacturability and significantly reduces the manufacturing cost of both the transceiver module and the entire radar sensor. The key technical characteristics and operability of a MMIC under external influences depend on the degree of protection provided by the hermetic enclosure.

When solving the problem of encapsulating a MMIC transceiver module for a 5 mm wavelength range, a pressing issue is the lack of domestically produced enclosures designed for this frequency range. Therefore, it is necessary to conduct research into the feasibility of using enclosures commercially available from domestic manufacturers operating at frequencies close to the 5 mm range. This paper presents the results of a study examining the impact of a Type 5 metal-ceramic package manufactured by NIIPP on the propagation of a frequency-modulated signal through the receiving and transmitting paths, depending on its installation options on a printed circuit board and the implementation of bonding between the crystal and the metal-ceramic package.

Theoretical studies of the impact of the monolithic integrated circuit package on the operation of the transceiver module were conducted using electromagnetic modeling of the propagation of a frequency-modulated signal through a test board in two frequency ranges:

up to 40 GHz – to verify the developed model of the metal-ceramic package;

from 40 to 65 GHz – to determine the signal attenuation and VSWR using the verified model.

To confirm the modeling results, an experimental measurement of the attenuation coefficient introduced by the metal-ceramic package was conducted. A test board was designed and manufactured for the measurements. The test board is a multilayer printed circuit board containing two 50-ohm coplanar lines. In the first channel, a coplanar line directly connects two microwave coaxial-to-waveguide adapters designed for connecting measuring equipment. The second channel consists of two coaxial-to-waveguide adapters and contains a break in the coplanar line. The break contains contact pads for surface mounting the metal-ceramic package of a monolithic integrated circuit.

For the study, a polycor wafer with a 50-ohm microstrip line printed on it was used. This wafer was mounted in a metal-ceramic package. The coplanar line between the wafer and the metal-ceramic package was connected with 20-μm-thick gold wire using thermal-sonic microwelding.

Theoretical and experimental studies showed that the average loss introduced by the metal-ceramic package at a frequency of
60±1,5 GHz does not exceed 8 dB. Thus, the possibility of sealing a monolithic integrated circuit of a five-millimeter wavelength transceiver module using a type 5 metal-ceramic housing manufactured by NIIPP has been demonstrated.

Dorogov A.D., Ivoylova M.M., Kornev N.S., Nazarov A.V., Osmanov R.R., Shulpin V.A. Packaging of a monolithic integrated circuit of a five-millimeter wavelength transceiver // Achievements of modern radioelectronics. 2026. V. 80. № 8. P. 16–25. DOI: https://doi.org/10.18127/j20700784-202608-03

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