A.V. Golubev

А.В. Голубев

2 articles 2016–2019

Radioengineering 2

2019

A method of designing a hermetically sealed multichip microwave modules in LTCC technology and the research of their thermal condition Radioengineering, No. 10, 2019 pp. 65-73

2016

Methodology for setting up of technological process for microwave modules manufacturing based on multilayer LTCC structures and its testing on pilot batch Radioengineering, No. 10, 2016 pp. 52-63