S.U. Uvaisov1, V.V. Chernoverskaya2, Zang Van Thanh3, Tao An Quan4, M.A. Kalmykov5
1–5 MIREA – Russian Technological University (Moscow, Russia)
The article is devoted to the consideration of the issues of rational placement of electronic device components on the switching field of the printed circuit assembly. The study solves the problem of one-parameter optimization, where the criterion for the placement efficiency is the uniformity of the temperature field over the node surface. The study is carried out in order to confirm the hypothesis that the rational placement of electrical radio products, carried out taking into account their characteristics, such as dissipated power and operating temperature, can improve the quality indicators of the designed unit and increase the reliability of the electronic device as a whole. Modern engineers-developers of radio-electronic devices need to solve a number of interrelated tasks that make it possible to design units and modules of electronic devices with specified operational and reliability characteristics that meet the requirements of the technical assignment. Taking into account the constant trend towards a decrease in the weight and size characteristics of nodes due to the use of ICs of a high degree of integration and a denser arrangement of electrical radioelements (ERE), on the one hand, and the desire to expand the functionality of the REU, on the other, these tasks often turn out to be contradictory in essence. In such a situation, it is important for the developer to determine priorities in solving design problems, based on the analysis of research results in the subject area, accumulated experience in implemented projects, and sometimes, guided by intuition and poorly formalized heuristic methods. The historical experience of the development of radio electronics and the design of the electronic equipment has shown that one of the key tasks solved by the developers at all stages of the life cycle of the electronic equipment is to ensure normal thermal modes of its operation. Among the methods of ensuring the thermal modes of the REU, various methods of ensuring heat removal are actively used, which make it possible to facilitate the functioning of the most loaded elements: perforation, forced ventilation, the use of radiators, thermal pastes, etc. All this entails changes in the design of the device, which, in turn, can lead to non-compliance requirements of the technical assignment, and the complication of the technological processes of the production of the product – to become the reason for going beyond the approved budget. The appearance in recent years of specialized CAD systems for solving design problems allowed the developers of the REU to actively apply the methods of mathematical modeling and research at the early stages of development, and the solution of optimization problems in the course of computational experiments makes it possible to develop the best version of the node design that meets all the requirements and provides the necessary resource reserve.
Uvaisov S.U., Chernoverskaya V.V., Zang Van Thanh, Tao An Quan, Kalmykov M.A. Technique for rational placement of printing unit elements of soft start device. Science Intensive Technologies. 2021. V. 22. № 7. P. 5−14. DOI: https://doi.org/10.18127/j19998465-202107-01 (in Russian)
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