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Journal Science Intensive Technologies №2 for 2017 г.
Article in number:
The thermal analysis of power microwave HIC operation
Authors:
V.A. Iovdalsky - Dr. Sc. (Eng.), Head of Department, JSC «RPC «Istok» named after Shokin (Fryazino, Moscow reg.); Associate Professor, Moscow Technological University (MIREA) N.V. Ganyushkina - Employee, JSC «RPC «Istok» named after Shokin (Fryazino) V.P. Marin - Academic APK, Dr. Sc. (Eng.), Professor, Moscow Technological University (MIREA) V.S. Seregin - Dr. Sc. (Eng.), General Director - General Designer, JSC «SPA «NIITAL» (Moscow) I.A. Sokolov - Ph. D. (Eng.), General Director - General Designer, JSC «NII «Micropribor» named after G.J. Guskov (Moscow)
Abstract:
The results of investigating the interaction of thermal fields of four Schottky FET crystals of microwave HIC fragment with parallel power addition are presented. It is shown that the increase of the heat conductivity factor of electro- and thermal plate (of additional heat sink) is leading to total decrease of the plate temperature level due to integrated heat sink effect increase and cooling of transistors contacting with the plate. Besides, with the increase of the heat conductivity factor the offset of temperature maximum from the upper transistor crystal to the lower one is observed. The developed microwave HIC design involves the use of crystals of more powerful transistors (up to several tens of watts), appearing in recent years.
Pages: 23-27
References

 

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