E.O. Pershin, D.B. Solovyov, A.S. Shalumov

This article presents a general methodology of fatigue life prediction of these electronic components within printed circuit assemblies (PCA) under mechanical effects. An automated subsystem of fatigue analysis of printed circuit assemblies under mechanical effects was developed. Mechanical characteristics of electronic components are determined using finite element modeling approach. The subsystem permits automatic transformation of ASONIKA-TM parametrical models into ANSYS solid model, and automatic finite element mesh generation. Dynamic analysis is performed within ANSYS environment. The vibration analysis provides system characteristics such as modal shapes and, and dynamic responses including displacements, accelerations, and stresses. Using the results of analysis, fatigue life is predicted based material durability information. The automated subsystem controls the analysis procedure and visualizes the modeling results. Using PCA models constructed in ASONIKA-TM, geometrical and material properties of electronic components are transferred to ANSYS preprocessor. The database of ASONIKA-TM contains a large number of parametrical models of electronic components with arbitrary mounting types. The program analyzes model-s information and generates a set of ANSYS macro commands which create the finite element model.