S.V. Kharalgin1, M.V. Fesenko2, T.S. Timoshenko3, A.G. Azizov4, А.А. Kalinin5
1,2,4,5 JSC “CNIRTI named after academician A.I. Berg” (Moscow, Russia)
3 Omsk Scientific-Research Institute of Instrument Engineering (Omsk, Russia)
1,2,4,5 post@cnirti.ru; 3 trs@oniip.ru
Problem statement. Microstrip lines (MSL) constructed using thick- or thin-film technology are traditionally used in the development of microwave devices for various electronic warfare (EW) components. The rapid development of EW systems necessitates the improvement of approaches to the implementation of microwave devices. One of the areas of development in the design of microwave devices is the use of technology based on multilayer low-temperature co-fired ceramics (LTCC). Changes in the manufacturing technology of microwave devices for EW systems necessitate the development of methods for ensuring optimal power transfer between microwave devices of planar design and those manufactured using LTCC technology in the form of symmetrical striplines (SSL), as well as the adaptation of measurement methods for the parameters of such microwave devices to account for the specific features of LTCC devices.
Goal. To develop a transition from the MSL to the SSL, allowing for simplified installation of LTCC measured devices using standard tools and an improved methodology for measuring the S-parameters of microwave devices.
Results. When using electrodynamic modeling of the transition from the MSL to the SSL was performed using a computer-aided design system. Based on an analysis of the characteristics of the electrodynamic model and optimization of the model's geometry parameters according to the criteria of maximizing the transmission coefficient and minimizing the reflection coefficient developed the transition from MSL to SSL which has the minimal impact on the characteristics of the measured LTCC device. The simulation results are confirmed by experimental measurements of bandpass filters (BPF) performed using LTCC technology. The methodology for measuring LTCC devices on a vector network analyzer (VNA) has been refined using test boards.
Practical significance. The developed transition from MSL to SSL allows for the integration of LTCC microwave modules during the modernization of microwave devices with MSL. The LTCC measurement technique using microwave probe heads and test boards allow for measurement of upgraded devices on universal work places when using standard microwave measuring instruments.
Kharalgin S.V., Fesenko M.V., Timoshenko T.S., Azizov A.G., Kalinin А.А. Ultra‑wideband transition design and testing for LTCC microwave devices with test boards. Radiotekhnika. 2026. V. 90. № 5. P. 102−108. DOI: https://doi.org/10.18127/j00338486-202605-13 (In Russian)
- Andreev G.I., Sozinov P.A., Tihomirov V.A. Osnovy teorii prinyatiya reshenij: Monografiya. Pod red. P.A. Sozinova. M.: Radiotekhnika. 2017. 648 s. (Nauchnaya seriya «Prinyatie reshenij v upravlenii») (in Russian).
- Ventcel' E.S. Issledovanie operacij. Zadachi, principy, metodologiya: Uchebnoe posobie dlya vuzov. M.: Drofa. 2004. 208 s. (in Russian).
- Andreev G.I., Sozinov P.A., Tihomirov V.A. Metodologiya modelirovaniya slozhnyh tekhnicheskih sistem: Monografiya. M.: Radiotekhnika. 2020. 512 s. (Nauchnaya seriya «Prinyatie reshenij v upravlenii») (in Russian).
- Voskresenskij D.I., Ponomarev L.I. Ustrojstva SVCh i antenny. Pod red. D.I. Voskresenskogo. Izd. 2-e, dop. i pererab. M.: Radiotekhnika. 2006. 376 s. (in Russian).
- Godin A.S., Macayan M.S., Gezha D.S., Klimov K.N. Primenenie principa elektrodinamicheskogo podobiya i special'nyh materialov dlya umen'sheniya gabaritov izluchatelya. Naukoemkie tekhnologii. 2016. № 4. S. 3-13 (in Russian).
- Ladur A.A. SVCh-zondy dlya izmereniya harakteristik planarnyh elementov integral'nyh skhem. Doklady TUSUR. 2010. № 2-1(22) (in Russian).
- Laptev I.V., Shadrin V.V. SVCh-zondy dlya izmereniya harakteristik planarnyh elementov integral'nyh skhem. Sbornik izbrannyh statej nauchnoj sessii TUSUR. 2021. № 1-1. S. 159-161 (in Russian).
- Voskresenskij D.I., Gostyuhin V.L., Maksimov V.M., Ponomarev L.I. Ustrojstva SVCh i antenny. Pod red. D.I. Voskresenskogo. Izd. 2-e, dop. i pererab. M.: Radiotekhnika. 2006. 376 s. (in Russian).
- Dzhurinskij K.B. Miniatyurnye koaksial'nye radiokomponenty dlya mikroelektroniki SVCh. Soediniteli, koaksial'no-mikropoloskovye perekhody, adaptery, SVCh – vvody, nizkochastotnye vvody, izolyacionnye stojki, fil'try pomekh. Izd. 2-e, ispr. i dop. M.: Tekhnosfera. 2006. 216 s. (in Russian).
- Leib M., Mirbach M., Menzel W. An ultra-wideband vertical transition from microstrip to stripline in PCB technology. 2010 IEEE Conference on Ultra-Wideband. China. 2010. Р. 1-4.
- Monastyrev E., Kevruh S. Moloshinikov V., Denisov P., Akimov A., Ponomarev A. LTCC based planar modules for X-band AESA. 2011 21th International Crimean Conference Microwave and Telecommunication Technology (CriMiCo). Sevastopol. 2011. Р. 195-197.
- Kondratyuk R. Nizkotemperaturnaya sovmestno obzhigaemaya keramika (LTCC). Preimushchestva. Tekhnologiya. Materialy. Peredovye tekhnologii. 2011. № 5. S. 14-17 (in Russian).
- Percel' Ya., Yakovlev A. Preimushchestva ispol'zovaniya tekhnologii nizkotemperaturnoj keramiki dlya realizacii radioelektronnyh ustrojstv. Sovremennaya elektronika. 2012. № 8. S. 16-17 (in Russian).

