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Journal Radioengineering №7 for 2025 г.
Article in number:
Development of a liquid cooling plate design using topological optimization methods
Type of article: scientific article
DOI: https://doi.org/10.18127/j00338486-202507-07
UDC: 681.5.01:658.512
Authors:

N.V. Tsipina1, N.E. Samoilenko2, D.R. Voronin3, K.D. Tsipina4

1-4 FSBEI of HE “Voronezh State Technical University” (Voronezh, Russia)

1 tcnv@mail.ru; 2 ju.i@mail.ru; 3 brk191frte6@gmail.com; 4 ksutsipina@mail.ru

Abstract:

Problem statement. The use of topological optimization methods in the design of electronic devices is a very promising technology. A large number of studies have been conducted worldwide on the use of topological optimization methods in the design of radioelectronic devices and heat dissipation elements. Due to the high degree of freedom in the design, the resulting structures have a significant advantage in the form of greater efficiency and at the same time lower weight and dimensions of the devices. In addition, modern additive manufacturing methods are not always able to reproduce the designs obtained using topological optimization. In order to reduce the number of errors when applying topological optimization approaches, this article discusses its main methods, problems, examples of successful application and prospects for the development of technology.

Purpose. Development of a liquid cooling plate design using topological optimization methods, to further supplement it with computer modeling.

Results. The design of a liquid cooling plate using topological optimization methods has been developed.

Practical significance. The presented technology is promising and effective for designing elements of passive and active cooling of electronic equipment. In addition, the use of topological optimization methods is beneficial from an economic and environmental point of view due to the reduction in the amount of material consumed in the process.

Pages: 37-41
For citation

Tsipina N.V., Samoilenko N.E., Voronin D.R., Tsipina K.D. Development of software for automated control of printed circuit board assemblies of electronic devices based on the analysis of their thermal fields. Radiotekhnika. 2025. V. 89. № 7. P. 37−41. DOI: https://doi.org/10.18127/j00338486-202507-07 (In Russian)

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Date of receipt: 28.05.2025
Approved after review: 02.06.2025
Accepted for publication: 30.06.2025