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Journal Radioengineering №3 for 2014 г.
Article in number:
The electromagnetic radiation levels assessment technique from the printed circuit board when providing of an EMC
Authors:
M.A. Romashchenko - Ph.D. (Eng.), associate professor, Voronezh State Technical University. E-mail: kipr@vorstu.ru
V.A. Shuvayev - Ph.D. (Eng.), associate professor, designing and manufacture radio equipment chairs, Voronezh State Technical University. E-mail: kipr@vorstu.ru
Abstract:
When operating radio electronic means on the printed circuit board (PCB) the differential and common currents causing issue of parasitic electromagnetic interference (EMI) in environmental space proceed. Also similar noises arise from the connected cables (the antenna mechanism) and supply/grounding layers (the mechanism of the cavity resonator). The offered technique and set of mathematical models allows to carry out the complex analysis issue of EMI from PCB. This stage is a component a method of topological verification providing of requirements EMC in radio electronic means constructions. The described technique consists of the following steps: Step 1. The «Emission of Differential Noises from PCB» procedure analyzes radiation level from differential currents in conductors on PCB, placed in shielded or unshielded enclosure. Step 2. The «Emission of Common Noises from Voltage Driven Source» procedure analyzes radiation level from a potential difference between massive metal constructs located near PCB. Step 3. The «Emission of Common Noises from Current Driven Source» procedure analyzes the level of the radiation arising when passing of common current through a return layer. Procedure provides series analysis of three main interference influence mechanisms «cable cable», «cable construct», «cable-PCB». Step 4. The «Emission from the Connected I/O Cables» procedure analyzes radiation level from common currents in the interface cables connected to circuits of input-output. Step 5. The «Emission from Power Bus» procedure analyzes radiation level from the power bus of PCB, executed on multi-layer technology with supply/grounding layers.
Pages: 97-100
References

  1. Paul S. Introduction to Electromagnetic Compatibility. Wiley Inter Science. 1992.
  2. Romashhenko M.A. Metody' topologicheskoj verifikaczii obespecheniya trebovanij e'lektromagnitnoj sovmestimosti v konstrukcziyax RE'S // Vestnik Voronezhskogo instituta MVD Rossii. 2013. № 4.