350 rub
Journal Information-measuring and Control Systems №8 for 2016 г.
Article in number:
Technologies of integration microphotonics solutions for advanced models of radioelectronic modules
Keywords: radioelectronic module optical interconnects (OIC) microphotonics monolithic design monolithic commutation board 3D-microsystem (3DMS) chip
Authors:
V.N. Vinogradov - Ph.D. (Eng.), Open Society - Concern "Vega". E-mail: p85-vvinogradov@vega.su L.V. Vorontsov - Ph.D. (Eng.), Deputy General Director, Open Society - Concern "Vega" (Moscow). E-mail: vlv@vega.su T.E. Grishutkina - Open Society - Concern "Vega" (Moscow). E-mail: tatyana@grishutkina.ru D.A. Danilenko - Leading Research Scientist, Open Society - Concern "Vega" (Moscow). E-mail: danilenko-d@yandex.ru A.M. Sechenykh - Senior Research Scientist, MNIIRIP. E-mail: sam@mniirip.ru
Abstract:
Existing achievements and potential/advanced directions of development integrated photonics considered in the article taking into account general classification of optical interconnects. We have produced information about national development of fabrication technology optical interconnects in this article. The technology is a single cycle, comprising the steps of fabrication high-density radio electronic module and forming opera-tions optical interconnects in its composition. Optical interconnects are formed in a square cross-section waveguides 10 × 10 microns. Application of optical interconnects allows to provide data transfer rate in a single channel optical interconnect at the level 10 Gbit /s. Areas of application technology - development and production modulesof computational, connected and radiolocating equipment: phased array antennas, board computers, RF-transceiver modules, backplanes, highly reliable controllers. Application of this technology will significantly improve the operational characteristics of radioelectronic modules.
Pages: 43-51
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